WMSIC Electronic Components

TECH PUBLIC PESD5V0U2BT

ModelPESD5V0U2BT
PackageSOT-23
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC PESD5V0U2BT
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
PESD5V0U2BT
Electronic Component
1
Package
SOT-23
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
2.5pF
Electronic Component
BM0228740071
Electronic Component
IEC 61000-4-5
Current(Ir)
60nA
Voltage(VBR)
9V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD5V0U2BT 产品概述

一、产品简介

PESD5V0U2BT 是 TECH PUBLIC(台舟电子)推出的一款双路双向静电与浪涌保护器件,采用 SOT-23 小封装,针对 5V 等低压电源与高速数据线提供行之有效的瞬态过压保护。器件符合 IEC 61000-4-5 浪涌防护等级,适用于移动终端、消费电子、接口电路等需要低容抗干扰保护的场合。

二、主要参数

  • 类型:ESD / TVS(静电与浪涌保护)
  • 反向截止电压 Vrwm:5V(典型应用于 5V 总线)
  • 击穿电压 Vbr:9V(器件进入雪崩导通区)
  • 极性:双向(对称钳位,支持正负瞬态)
  • 通道数:双路(两路独立保护)
  • 结电容 Cj:2.5 pF(低电容,适合高速信号)
  • 反向电流 Ir:60 nA(在 Vrwm 下的低漏电流)
  • 防护等级:符合 IEC 61000-4-5 浪涌要求
  • 封装:SOT-23(小体积,便于表面贴装)

三、产品特点

  • 低电容(2.5 pF):对高速数据线(如 USB、串行总线等)影响小,信号完整性损失低。
  • 双路双向保护:可同时保护差分信号对或两路独立信号线,支持正负方向瞬态抑制。
  • 低漏电流(60 nA):适合电池供电与低功耗系统,减少静态功耗影响。
  • 适用于 5V 总线:5V 反向截止电压与 9V 击穿电压组合,可在常见 USB/TTL/信号接口上工作。
  • 小体积封装:SOT-23 占板面积小,便于在空间受限的产品中部署。
  • 符合 IEC 61000-4-5:具备对浪涌脉冲的抑制能力,提升系统的电磁兼容性(EMC)。

四、典型应用

  • USB、OTG、充电口与数据口的浪涌与静电保护
  • 手机、平板、便携设备的外部接口保护
  • 串口、I2C、SPI、UART 等通信线路的防护(注意匹配信号电平)
  • 工业控制设备、传感器接口的浪涌耐受设计

五、设计与布局建议

  • 器件应尽量靠近被保护的接口或连接器放置,以缩短走线并降低寄生电感。
  • 保护引脚到接地(或公共参考点)的回流路径应尽量短且宽,最好直连地平面或参考地环。
  • 对于高速差分对,确保 TVS 的结电容对差分阻抗的影响在可接受范围内,并避免在差分对上并联过多额外电容。
  • 在潮湿或高静电环境下,应配合适当的防护结构(接地罩、屏蔽)和滤波元件以增强整体鲁棒性。
  • 焊接与回流工艺遵循元器件厂商的温度曲线与 ESD 操作规程,避免在装配过程中损伤器件。

六、封装与采购

PESD5V0U2BT 标准 SOT-23 封装,适合自动贴装与回流焊接。采购时请确认供应商(TECH PUBLIC / 台舟电子)提供的器件批次、器件标识和相关测试报告(如 IEC 61000-4-5 测试结果)以满足项目的可靠性要求。若需替代或在特定应用下验证钳位电压、冲击能量承受能力,请与供应商索取详尽的电气特性曲线与典型浪涌钳位数据。

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