WMSIC Electronic Components

TECH PUBLIC ESD5V0B03-523 ESD5V0B03

ModelESD5V0B03-523
PackageSOD-523
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC ESD5V0B03-523
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
ESD5V0B03-523
Electronic Component
1
Package
SOD-523
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Cj- Capacitor
0.35pF
Electronic Component
BM0257708795
Voltage
20V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
200nA
Voltage(VBR)
8.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5V0B03-523 产品概述

一、产品简介

ESD5V0B03-523 是台舟电子(TECH PUBLIC)推出的一款面向高速接口与电源线防护的浪涌/静电保护器件,封装为SOD-523 小体积封装,适合空间受限的消费电子与通讯设备。器件类型为 ESD 防护,符合 IEC 61000-4-2(静电放电)与 IEC 61000-4-5(雷击/浪涌)标准。主要电气参数包括:反向截止电压 Vrwm = 5V,击穿电压 Vbr = 8.5V,钳位电压 Vc ≈ 20V(8/20μs),峰值脉冲电流 Ipp = 4A(8/20μs),峰值脉冲功率 Ppp = 80W(8/20μs),静态反向电流 Ir = 200nA,结电容 Cj = 0.35pF(低电容,利于信号完整性)。

二、主要特性

  • 低反向漏电流(Ir = 200nA),适合对漏电敏感的电路。
  • 低结电容(0.35pF),对高速信号影响极小,利于 USB/高速数据线的信号完整性。
  • 良好的浪涌与脉冲吸收能力(Ipp 4A,Ppp 80W@8/20μs),在常见工业和民用环境下能有效钳位有害瞬态。
  • 符合 IEC 61000 系列标准,可通过系统级电磁兼容性(EMC)要求。
  • SOD-523 小封装,适合手机、平板、可穿戴设备、USB 接口和其他空间受限应用。

三、典型应用场景

  • USB(供电与数据)接口、OTG 接口与移动电源输入保护(5V 工作电压环境)。
  • 高速信号线保护(如 USB2.0、低速差分对及一般串行接口),因低 Cj 对信号干扰极小。
  • 小型消费电子、无线模组、IoT 终端、摄像头模块等需局部浪涌/ESD 保护的场合。
  • 辅助用于电源线上对瞬态浪涌的抑制与旁路。

四、设计与布局建议

  • 器件应尽可能靠近受保护的连接器或端口放置,以缩短走线并降低寄生电感,提升钳位效率。
  • 将器件接地端通过多孔过孔紧密接入系统地(GND),并避免中间长走线或大环路。
  • 对于高速差分信号,保持对称走线并在靠近连接器处放置保护器,利用其低结电容优势维持信号完整性。
  • 在板级设计中结合合适的滤波与去耦电容,协调器件响应与系统稳定性。
  • 焊接与回流建议遵循封装的标准回流曲线和厂商焊接说明,避免过热或长时间高温暴露。

五、封装与可靠性

SOD-523 超小封装便于自动贴装与高密度布局,同时需要在生产与维修过程中注意静电防护与潮湿敏感性。器件通过 IEC 61000-4-2/4-5 认证,适合多数工业与民用级 EMC 要求。建议在设计验证阶段通过实际的 ESD/浪涌测试,确认在目标系统中的保护效果与钳位表现。

总结:ESD5V0B03-523 以其 5V 反向截止电压、低结电容与良好的脉冲吸收能力,适合对体积、信号完整性和抗静电、抗浪涌能力有较高要求的 5V 工作环境,是移动与接口保护的优选器件。

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