WMSIC Electronic Components

TECH PUBLIC GBLC05C

ModelGBLC05C
PackageSOD-323
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC GBLC05C
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
GBLC05C
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.034g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
1pF
Electronic Component
BM0225773305
Voltage
19V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
200nA
Voltage(VBR)
8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GBLC05C 产品概述

一、产品简介

GBLC05C 是台舟电子(TECH PUBLIC)推出的一款单路双向瞬态电压抑制/静电放电保护器件(TVS/ESD),封装为 SOD-323,专为敏感信号线和低电压接口提供高效的静电和浪涌保护。器件符合 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)防护等级,能在有限封装内实现快速钳位与低寄生电容。

二、主要特性

  • 钳位电压(Vc):19V(典型钳位值,在规定浪涌电流下保证对后端器件的保护)
  • 击穿电压(Vbr):8V(器件进入导通状态的起始电压)
  • 反向截止电压 Vrwm:5V(连续工作电压上限,适用于 5V 及以下系统)
  • 极性:双向(双向对称保护,适合交流或双极性信号)
  • 通道数:单路
  • 结电容 Cj:约 1pF(对高速数据或射频信号影响极小)
  • 反向电流 Ir:200nA(低漏电流,适合低功耗应用)
  • 封装:SOD-323(小尺寸,便于移动设备与空间受限的电路板设计)

三、电气参数解读与选型建议

由于 Vrwm 为 5V,该器件适合保护 5V 及以下的电源或信号线;双向结构无需方向区分,方便用于双向数据总线或没有固定极性的接口。1pF 的结电容使其非常适合 USB、TTL、串行通信和高频信号线的防护,能在不显著影响信号完整性的前提下吸收瞬态能量。钳位电压 19V 显示在遭受较大瞬态冲击时,能有效将电压限制在对后端元件安全的范围内(具体钳位效果请参考数据手册测试条件)。

四、封装与布局建议

SOD-323 为小体积表贴封装,建议:

  • 将器件尽量靠近需保护的连接器或器件引脚布局,以缩短引线感抗;
  • 接地端应采用低阻抗回流路径,必要时增加短、粗的地铜与过孔到地平面;
  • 对于高速信号,注意保持器件与差分对的对称布局,避免串扰增大。

五、使用注意事项与可靠性

  • 本器件为瞬态抑制器,不适合作为连续功率开关或替代限流元件;应保证工作电压不超过 Vrwm(5V)以避免持续导通;
  • 在高能量浪涌场合,需根据系统能量计算是否需要并联更大能量吸收器或选用额定更高的 TVS;
  • 关注封装焊接温度曲线,避免因回流焊不当影响可靠性;在 PCB 设计与生产中遵循厂商推荐的焊盘尺寸与回流规范。

GBLC05C 以小封装、低电容和双向保护为主要优势,适用于手机配件、接口保护、通信模块及各种 5V 及以下信号线的抗静电与抗瞬态干扰保护。欲获得完整电气曲线和测试条件,请参考台舟电子提供的详细数据手册。

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