WMSIC Electronic Components

TECH PUBLIC TPUSBLC6-4SC6 TPUSBLC6

ModelTPUSBLC6-4SC6
PackageSOT-23-6
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPUSBLC6-4SC6
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPUSBLC6-4SC6
Electronic Component
1
Package
SOT-23-6
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.038g
Electronic Component
1
Cj- Capacitor
0.35pF;0.8pF
Electronic Component
BM0228740069
Operating Temperature
55℃~+125℃
Voltage
20V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
300nA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPUSBLC6-4SC6 产品概述

一、核心特性

TPUSBLC6-4SC6 是 TECH PUBLIC(台舟电子)推出的一款用于静电放电(ESD)与浪涌保护的多通道瞬态电压抑制器(TVS/ESD),针对USB及其他低压高速信号线的过压与脉冲抑制进行了优化。其主要特性包括:

  • 反向截止电压 Vrwm:5V,适配5V供电系统(例如USB);
  • 钳位电压(Vcl):20V(典型),在浪涌事件中对系统提供有效的电压钳制;
  • 峰值脉冲电流 Ipp:3A(8/20µs),可承受常见的浪涌冲击;
  • 反向电流 Ir:300nA(典型),低漏电保证不影响待保护线路的正常工作;
  • 结电容 Cj:提供两种标称值 0.35pF 与 0.8pF,可根据信号速率与抗干扰需求选择;
  • 防护等级:满足 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)相关要求;
  • 封装:SOT-23-6,体积小、便于表贴装配。

二、典型电气参数

  • 反向截止电压(Vrwm):5V(适配5V系统工作电压)
  • 钳位电压(Vcl,8/20µs 浪涌):约20V(浪涌过程中对线路的限制电压)
  • 峰值脉冲电流(Ipp):3A @ 8/20µs(单次脉冲能力)
  • 反向漏电流(Ir):300nA(在工作电压下的静态泄漏)
  • 结电容(Cj):0.35pF(低容型,适合高速差分信号) 或 0.8pF(通用型)
    注:具体参数请参考器件正式数据手册以获得典型值与最大值的完整曲线与测试条件。

三、封装与引脚说明

  • 封装类型:SOT-23-6(小型 6 引脚表贴封装)
  • 多通道集成:在单一封装内集成对多路信号的保护,节省 PCB 面积并简化线路保护设计。
  • 引脚功能通常包括多个信号通道输入/输出与地(GND)引脚,适合同时保护数据线和供电线。具体引脚分配请参见厂方数据手册。

四、主要应用场景

  • USB 2.0 / USB OTG 接口(D+/D-、VBUS)静电与浪涌保护;
  • 手机、平板、笔记本等移动终端的外部接口保护;
  • 工业控制与消费电子产品的短距离高速差分数据线保护;
  • 任何需在 5V 工作电压下兼顾低漏电与低结电容的信号保护场景。
    注意:对于超高速接口(例如 USB3.x / 5Gbps 及以上)或射频敏感线路,请核实结电容对信号完整性的影响,必要时选择更低电容或专用的高速保护器件。

五、设计与选型建议

  • 若保护对象为 USB2.0 数据线,优先选择 Cj = 0.35pF 版本,以最小化对上升/下降时间与差分阻抗的影响;
  • 对于只需对供电线/次级保护且对带宽要求不高的场合,Cj = 0.8pF 版本可提供更高能量吸收余量;
  • 留意钳位电压与正常工作电压的差值,虽然 Vrwm 为 5V,但钳位到达时可能达到 ~20V,应保证后端元件能承受该短时电压或通过限流器件进一步保护;
  • 在多通道保护设计中,确保 GND 回路短且阻抗低,以便快速将能量导入地线,减少对其它敏感器件的干扰。

六、布局与散热建议

  • 将 TPUSBLC6-4SC6 靠近需要保护的接口放置,信号线和保护器之间走线短且粗;
  • GND 引脚应与系统地平面直接相连,避免经长走线接地以减少寄生感抗;
  • 对于频繁承受高能量脉冲的场合,评估 PCB 铜箔散热与周边器件的耐受能力;
  • 在 USB 接口入口处配合常规的差模滤波器与串联阻抗(如共模电感、阻尼电阻)可进一步改善抗扰度与匹配。

七、可靠性与合规性

  • 该器件满足 IEC 61000-4-2 与 IEC 61000-4-4 等静电与快速瞬变防护标准的设计要求,适合商业与工业环境使用;
  • 低漏电与低结电容设计有助于长期稳定工作,焊接、回流等工艺兼容 SOT-23-6 的常规工艺规范。为保证可靠性,请遵循厂方提供的回流曲线与焊接说明。

八、总结

TPUSBLC6-4SC6 是一款面向 5V 系统(如 USB 接口)提供多通道 ESD/浪涌保护的 SOT-23-6 封装 TVS 器件。其 5V Vrwm、20V 钳位、3A(8/20µs)脉冲承受能力与低漏电(300nA)使其在保护性能与对信号干扰之间取得良好平衡;提供 0.35pF 与 0.8pF 两种结电容选项,可以根据高速信号完整性需求与能量吸收需求灵活选型。选用时建议结合实际信号带宽、系统接地与PCB布局做综合评估,必要时参考 TECH PUBLIC 提供的完整数据手册与应用笔记。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.