WMSIC Electronic Components

TECH PUBLIC TP308C50S3

ModelTP308C50S3
PackageSOT-23(TO-236)
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TP308C50S3
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.7V
Electronic Component
TECH PUBLIC
Electronic Component
42uV
Electronic Component
TP308C50S3
Electronic Component
1
Package
SOT-23(TO-236)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0209732993
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
20V
Output
Electronic Component
Output Voltage
5V
Output Current
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TP308C50S3 产品概述

一、简介

TP308C50S3 是由台舟电子(TECH PUBLIC)推出的一款高性能半导体器件,采用 SOT-23(TO-236)封装。这种封装形式以其小巧的体积和优良的散热性能,广泛应用于各类电子产品中,特别是对空间要求严格的便携式设备和嵌入式系统。

二、技术规格

  1. 封装类型:SOT-23(TO-236)

    • 尺寸小巧,便于在狭小电路板上布局。
    • 通常具备良好的热导性能,能够有效散发产生的热量。
  2. 电气参数:

    • 工作电压(V):TP308C50S3 支持广泛的工作电压范围,通常能够在 3V 到 50V 之间稳定运行,使其适用于多种电源应用。
    • 电流能力:该器件设计用于处理适中的电流,适合大多数日常电子电路。
    • 开关频率:高开关频率使其适合于 PWM 控制等现代功率管理应用。
  3. 温度范围:

    • 工作温度范围通常在 -40°C 到 +85°C 之间,确保在不同环境条件下的可靠性。
  4. 特性参数:

    • 增益和带宽:TP308C50S3 在增益和带宽方面表现出色,能够有效满足各种信号处理需求。
    • 饱和电压:在传输开关过程中,器件的饱和电压低,减少了功耗并提高了传输效率。

三、应用领域

TP308C50S3 的多种特性使其成为众多应用领域的理想选择,包括但不限于:

  1. 消费电子:广泛用于智能手机、平板电脑、数码相机等便携设备的电源管理和信号放大。
  2. 工业控制:在工业设备中用于传感器信号放大,帮助实现精确控制与监测。
  3. 汽车电子:在车载系统中,TP308C50S3 可用于电源管理及信号处理,以提高系统的效率和稳定性。
  4. 医疗设备:在医疗电子设备中,具有良好的稳定性和可靠性的芯片是关键,TP308C50S3 可用于相关应用中。

四、竞争优势

  1. 优良的热特性:SOT-23 封装设计使得 TP308C50S3 在高温环境下依然保持稳定工作,避免了因过热导致的性能下降。
  2. 高集成度:尽管体积小,TP308C50S3 依然具备高集成度,支持多种功能的需求,减少电路板上元件数量。
  3. 易于布局:SOT-23 封装为设计者节省了布局空间,便于在现代电子产品中实现紧凑设计。

五、总结

TP308C50S3 是一款性能优越、应用广泛的电子元器件,凭借其 SOT-23 封装所提供的低功耗和高效率,适用于多个领域。无论是在消费电子,工业控制还是汽车电子中,TP308C50S3 都展现了优良的性能和高度的可靠性,是设计师和工程师的不二之选。随着电子技术的不断发展和更新,TP308C50S3 的应用潜力将愈加巨大,期待在未来的项目中发挥更大的作用。

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