Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TECH PUBLIC ESDA5V3L
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC ESDA5V3L
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- ESDA5V3L
- Electronic Component
- 1
- Package
- SOT-23-3
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Cj- Capacitor
- 70pF
- Electronic Component
- BM0220136600
- Operating Temperature
- 55℃~+125℃
- Voltage
- 13.5V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 6V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：ESDA5V3L - 静电和浪涌保护器件
一、基本信息
ESDA5V3L是由TECH PUBLIC（台舟电子）生产的一款静电和浪涌保护器件，采用SOT-23-3封装。此元器件旨在保护敏感的电子线路不受静电放电（ESD）和浪涌电流的损害。在现代电子设计中，尤其是在便携设备、通信设备和消费电子产品中，ESDA5V3L为设计师提供了一种有效的解决方案，以提高产品的可靠性和耐用性。
二、产品特点
高效的ESD保护：ESDA5V3L能够有效吸收和消散高达±8kV（接触放电模式）和±15kV（空气放电模式）的静电放电，确保电子设备在遭受静电放电时的安全和稳定运行。
浪涌保护：该器件接受的浪涌电流具有良好的承受能力，为电子设备提供额外的保护，防止因瞬时电压升高而导致的电路损坏。
低钳位电压：ESDA5V3L具有较低的钳位电压，能在瞬态过电压情况下最大限度地减少对敏感元件的损害。这一特性适用于需要高可靠性和高精度的应用场景。
小巧的封装：采用SOT-23-3封装，体积小巧，便于在空间受限的设计中集成。其轻量化特性使得产品适用于便携设备，如智能手机、平板电脑等。
易于应用：ESDA5V3L可直接与其他电子元件配合使用，简化了电路设计，提供了较好的设计灵活性。
三、应用领域
ESDA5V3L广泛应用于各类电子产品中，包括但不限于：
- 消费电子：如智能手机、平板电脑、家用电器等。
- 计算机和外围设备：如笔记本电脑、打印机、外部存储器等。
- 汽车电子：在汽车电话、导航系统及其他车载电子设备中提供保护。
- 工业设备：在自动化设备、控制系统及传感器中，确保设备的稳定运行。
四、性能参数
针对ESDA5V3L，以下是一些关键的电气特性参数（具体参数可参照产品数据手册）：
- 工作温度范围：-55°C 到 +125°C
- 反向击穿电压（VBR）：5V
- 漏电流（IR）：小于1µA
- 钳位电压（VCL）：≤ 9V (在特定浪涌条件下)
这些性能参数使得ESDA5V3L成为各种电子产品设计中不可或缺的保护部件。
五、总结
总之，ESDA5V3L作为TECH PUBLIC推出的一款高效静电和浪涌保护器件，以其优异的性能和紧凑的设计赢得了电子设计工程师的信赖。它不仅能有效保护电路免受静电和浪涌的侵害，也提高了产品的整体可靠性和有效性。随着电子技术的发展，选择合适的保护方案对产品的成功至关重要，而ESDA5V3L则为设计师提供了一种理想的解决方案，帮助其在日益竞争激烈的市场中保持竞争优势。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
