Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TECH PUBLIC XC6206P152MR(1uA) XC6206P152MR
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC XC6206P152MR(1u A)
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 470mV@(100mA)
- Electronic Component
- TECH PUBLIC
- Electronic Component
- XC6206P152MR(1uA)
- Electronic Component
- 1
- Package
- SOT-23-3L
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0231019640
- Operating Temperature
- 25℃~+85℃@(Ta)
- Operating Voltage
- 7V
- Output
- Electronic Component
- Output Voltage
- 1.5V
- Output Current
- 200mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC6206P152MR(1uA) 产品概述
一、产品简介
XC6206P152MR 是 TECH PUBLIC（台舟电子）提供的一款固定输出线性稳压器，输出电压 1.5V，面向超低功耗与便携式电源管理场景。器件以极低静态电流（Iq = 1 μA）为亮点，兼具过流保护与短路保护，封装为常见的 SOT-23-3，方便在空间受限的应用中替代大体积稳压方案。
二、主要参数
- 输出类型：固定输出
- 输入/工作电压：7V（按规格书限制）
- 输出电压：1.5V
- 输出电流：最大 200 mA
- 压差（Dropout）：470 mV @ 100 mA
- 静态电流（Iq）：1 μA
- 保护功能：过流保护、短路保护
- 工作温度范围：-25 ℃ ~ +85 ℃（Ta）
- 输出极性：正极输出
- 输出通道数：1（单路）
- 封装：SOT-23-3L
三、性能亮点
- 超低静态电流（1 μA），非常适合电池供电或待机功耗敏感的设备；
- 中等输出能力（200 mA）可满足大多数传感器、低功耗 MCU 与外围芯片的供电需求；
- 具有压差指标（470 mV @100 mA），在高电流时需关注输入电压裕量；
- 内建过流与短路保护，提高系统可靠性与调试容错性。
四、封装与热设计提示
SOT-23-3 小型封装便于布局但热阻较大。注意功耗计算：Pd = (Vin - Vout) × Iout。在 Vin 接近 7V、输出 1.5V 并驱动 200 mA 时，器件耗散功率可能接近或超过 SOT-23 的安全散热能力，建议降低输入电压、限制连续输出电流或通过 PCB 铜箔散热与热过载保护进行热管理。
五、典型应用场景
- 电池供电便携设备（手持仪表、传感终端、可穿戴设备）；
- 实时时钟、低功耗 MCU 及射频前端供电；
- 低功耗传感器模块、待机电路、电源基准点等场合。
六、使用建议与注意事项
- 推荐在输入端与输出端使用低 ESR 去耦电容以保证稳定性，具体电容值与 ESR 范围请参照厂家数据手册；
- 布局时将输入/输出电容靠近引脚放置，输入端尽量有良好接地回流路径；
- 若系统存在大电流瞬态负载，需评估压差与输出保持能力；
- 在高环境温度或连续大电流条件下，建议评估热关断与热漂移对输出的影响并适当降额使用。
如需电路示例、引脚定义或厂家详细数据表（包括稳定性条件与外部电容推荐），建议参考 XC6206P152MR 原厂数据手册以获得完整应用与可靠性指导。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
