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TECH PUBLIC BSP170P
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC BSP170P
- Type
- TECH PUBLIC
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- BSP170P
- Electronic Component
- 1
- Package
- SOT-223
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.23g
- Electronic Component
- 1
- Electronic Component
- BM0230027713
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage(Vdss)
- 60V
- Capacitor(Ciss)
- 637pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSP170P 产品概述
一、概述
BSP170P 是 TECH PUBLIC（台舟电子）推出的一款低压小功率场效应晶体管（FET），封装为 SOT-223，适用于中小电流开关与功率管理场合。器件额定漏源电压 Vdss=60V，连续漏极电流 Id=3A，工作温度范围宽 (-55℃ ~ +150℃)，兼顾耐压与可靠性。
二、主要电气参数
- 导通电阻 RDS(on)：95 mΩ @ VGS=10V、ID=3A
- 阈值电压 VGS(th)：3V（典型）
- 栅极总电荷 Qg：9.8 nC @ VGS=5V（栅极驱动需求中等）
- 输出电容 Coss：70 pF
- 输入电容 Ciss：637 pF @ 30V
- 反向传输电容 Crss (Miller)：53 pF @ 30V
- 耗散功率 Pd：2 W
以上参数表明器件在 10V 栅压下能获得较低的导通电阻，但在 5V 驱动下可能无法完全达到最优导通性能；同时 Ciss 和 Crss 数值提示在开关切换时需关注驱动能力与米勒效应。
三、典型应用
- DC-DC 转换器与同步整流（中低功率）
- 负载开关、电源管理与保护电路
- 小功率电机驱动与继电器替代
- 通信与工业控制中的开关元件
四、封装与热管理
SOT-223 封装便于 PCB 布局与散热，但 Pd=2W 要求合理的铜箔散热面积与散热通孔布局。在满载（ID=3A）条件下，器件功耗可能接近 1W 量级（例如 3A×0.095Ω ≈ 0.285V 压降，对应约 0.855W 损耗），需根据环境温度和 PCB 散热设计进行功率热阻与结温评估，避免超温运行。
五、选型建议与注意事项
- 若系统栅极驱动仅为 3.3V，应谨慎：VGS(th)=3V，5V 下 Qg 给出，但 3.3V 可能无法充分导通，导致较高 RDS(on) 与损耗。优选 10V 驱动或使用低门限逻辑级 MOSFET。
- 开关频率较高时，Ciss 与 Qg 将直接影响驱动损耗与开关损耗，需选择合适驱动器并考虑驱动功耗。Crss（53 pF）提示米勒效应在快速上升沿会影响栅极电压，注意阻尼与 RC 保护。
- 在设计中预留足够的散热铜面积、使用热过孔或加装散热片，以在高环境温度下满足 Pd 限制。
- 对应电流与功耗下，应计算结-周围温度升高并进行热裕量评估，保证长期可靠性。
六、典型电路与布局建议
- 栅极旁并联小电阻（10–100 Ω）以抑制振铃并限制峰值电流；必要时并联 TVS 或 RC 以防止过压。
- 源极尽量靠近地参考平面，漏极大焊盘连接至散热铜箔；缩短栅极到驱动器的走线以降低寄生电感。
- 在高频开关应用中，可在栅极与源极间并联去耦电容，改善开关行为。
总结：BSP170P 在 60V 耐压范围内以 SOT-223 封装提供了适合中低功率开关与电源管理的解决方案。为达到最佳性能，应保证足够的栅极驱动电压、合理的散热设计及合适的驱动器匹配。
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