Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TECH PUBLIC CESD5V0D3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC CESD5V0D3
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- CESD5V0D3
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 160pF
- Electronic Component
- BM0223280804
- Operating Temperature
- 55℃~+125℃
- Voltage
- 20V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 500nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CESD5V0D3 是由台舟电子（TECH PUBLIC）推出的一款电子元器件，主要用于对电路中的敏感器件提供过压保护。以下是该产品的详细概述，包括其基本特性、应用场景和主要优势。
产品概述
基本特征
CESD5V0D3 的封装采用 SOD-323 形式，具有小型化、轻量化的特点，适合对空间要求严格的应用场合。该器件设计用于在电压超过其阈值时进行瞬态电压抑制，从而有效保护电子设备免受电流尖峰和电压突波的影响。
- 额定电压: CESD5V0D3 的钳位电压为 5V，能够在电路中实现对超过该电压的快速响应，可以减少对后端电子元器件的潜在损害。
- 响应时间: 采用最新材料与结构设计，具有较快的响应时间，可以在微秒级别内对突发电压进行响应。
性能指标
CESD5V0D3 不仅具有卓越的过压保护功能，还具备以下性能指标：
- 低泄漏电流: 在正常工作状态下，流经器件的泄漏电流极低，适合对功耗有严格要求的设备。
- 高重复性: 能够应对频繁的电压尖峰而不影响其保护性能，适合长时间连续工作的电路。
- 优良的热稳定性: 在高温环境下仍能保持良好的性能，保证长期稳定的工作表现。
应用场景
CESD5V0D3 广泛应用于各种电子设备中，特别是在以下场合：
- 消费电子: 在智能手机、平板电脑、笔记本电脑及其他便携式电子设备中，CESD5V0D3 可用于保护 IC 模块、传感器及其他敏感组件。
- 工业设备: 用于工业控制系统，保护关键的传感器和执行元件，使设备在波动电压的情况下保持稳定工作。
- 汽车电子: 在汽车电子领域，CESD5V0D3 能够有效保护车载通信设备、导航系统及其他电子控制单元。
主要优势
小型化设计: SOD-323 封装使得 CESD5V0D3 适合于空间有限的电子产品，有利于设计更紧凑的设备。
高性价比: 由台舟电子提供的高质量元器件通常具有竞争力的价格，能降低整体产品的制造成本。
可靠性: CESD5V0D3 在产品设计中充分考虑了长期稳定性和可靠性，使其在多种苛刻环境下仍能保持良好的工作性能。
易于集成: 适合与其他元器件实现简单的电路设计，方便快速部署到实际应用中。
结论
CESD5V0D3 是一款功能强大且可靠的过压保护器件，非常适合需要高效电压保护的应用场合。无论是在消费电子、工业自动化还是汽车电子领域，CESD5V0D3 的卓越性能和设计优势都能为电路提供稳定的保护，使其能够承受各种电压波动，以确保最终产品的耐用性和用户体验。选用 CESD5V0D3 ，不仅是在保护电路，更是在为设备的长久使用安全保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
