WMSIC Electronic Components

TECH PUBLIC SP3232EEN

ModelSP3232EEN
PackageSOP-16
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
TECH PUBLIC SP3232EEN
Type
TECH PUBLIC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SP3232EEN
Electronic Component
1
Package
SOP-16
Electronic Component
0.275g
Electronic Component
1
Electronic Component
BM0264777500
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3232EEN 低功耗RS-232收发器产品概述

一、产品基本属性与定位

SP3232EEN是台舟电子(TECH PUBLIC)推出的双路RS-232串行通信收发器,采用SOP-16表面贴装封装,核心功能是实现TTL/CMOS逻辑电平与RS-232标准电平的双向转换,适配需要RS-232接口的各类电子系统。

二、关键性能参数解析

该产品的参数明确了应用边界与性能表现:

  1. 收发能力:内置2个RS-232驱动器和2个接收器,支持双路独立串行通信,可同时连接两个RS-232设备,提升系统接口密度;
  2. 通信速率:最大数据速率达250Kbps,满足工业控制、仪表通信等低速串行场景需求;
  3. 电源特性:工作电压3V~5.5V,兼容主流MCU的3.3V/5V逻辑电平,无需额外电平转换;静态电流仅1.5mA,低功耗适配电池供电设备;
  4. 可靠性设计:静电防护达±12kV(空气放电),抵御工业静电干扰;内置电荷泵,无需外部高压电源(如±12V),单电源即可生成RS-232所需正负电平;
  5. 环境适应性:工作温度-40℃~+125℃,符合工业级标准,稳定适配户外、车载等极端场景。

三、封装与典型应用场景

封装特点

SOP-16封装引脚间距1.27mm,适合自动化贴片生产,体积小巧节省PCB空间,适配紧凑型设备设计。

典型应用

  1. 工业控制:PLC串口扩展、工业传感器数据采集、现场总线通信;
  2. 便携设备:手持终端、数据采集器、便携式医疗仪器的RS-232模块;
  3. 车载电子:OBD诊断接口、车载信息娱乐系统串口通信;
  4. 接口转换:旧款RS-232设备(如打印机、调制解调器)与3.3V/5V MCU的电平适配;
  5. 医疗仪器:监护仪、心电图机的串口数据输出,满足宽温、低功耗需求。

四、核心优势与差异化

相比传统RS-232收发器,SP3232EEN具有:

  1. 简化电路:内置电荷泵仅需4个0.1μF陶瓷电容,减少BOM成本与PCB空间;
  2. 宽温稳定:-40℃~+125℃覆盖户外、车载等极端温度;
  3. 低功耗:1.5mA静态电流延长电池供电设备续航;
  4. 强抗静电:±12kV ESD防护降低工业环境损坏概率;
  5. 多电压兼容:3V~5.5V适配3.3V/5V系统,无需电源转换。

五、总结

SP3232EEN作为工业级低功耗RS-232收发器,凭借内置电荷泵、宽温范围、低静态电流等特性,成为传统RS-232接口与现代数字系统的理想转换方案。双路收发与紧凑封装适配多场景需求,适用于工业控制、便携设备、车载电子等领域,是简化电路、提升可靠性的优选器件。

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