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TECH PUBLIC TPESD0201G05V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC TPESD0201G05V
- Type
- TECH PUBLIC
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- TPESD0201G05V
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.05pF
- Electronic Component
- BM0230027710
- Operating Temperature
- 55℃~+125℃
- Voltage
- 40V
- Electronic Component
- IEC 61000-4-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TPESD0201G05V 产品概述
一、产品简介
TPESD0201G05V 是 TECH PUBLIC（台舟电子）推出的一款超小型单路双向 ESD 保护器件，封装为 0201，专为对信号完整性要求高且空间受限的系统设计。器件在极性为双向的情况下对高幅值电静电放电提供快速钳位保护，同时保持极低的结电容和漏电流，适合高速数据线与敏感模拟/射频线路的防护需求。
二、主要电气参数
- 类型：ESD 保护器件（单路、双向）
- 反向截止电压 Vrwm：5 V（适用于 5V 及以下工作电压系统）
- 钳位电压：40 V（在规定冲击条件下的最大钳位参考值）
- 反向电流 Ir：10 nA（高阻态下的漏电流极小）
- 结电容 Cj：0.05 pF（超低电容，几乎不影响高速信号）
- 工作温度范围：-55℃ ~ +125℃
- 防护等级：符合 IEC 61000-4-2（ESD 抗扰度标准）
三、封装与物理特性
- 封装：0201（超小型表面贴装，适合高密度 PCB 布局）
- 品牌：TECH PUBLIC（台舟电子） 0201 尺寸带来空间优势，但对贴装精度与回流工艺要求较高，适配自动贴片与精密回流工艺线。
四、典型应用场景
- 高速数据接口保护：USB、LVDS、MIPI 等对带宽与失真敏感的差分/单端信号线
- 移动设备与可穿戴设备：空间受限、对功耗与信号完整性要求高的终端
- 工业控制与传感前端：需要抗静电而不影响测量精度的信号输入
- 通信与射频前端：超低电容特性适合对寄生电容敏感的射频链路保护
五、布板与使用建议
- 尽量将器件放置于信号入口点或连接器附近，靠近被保护器件的接地回路。
- 引脚到地的走线应尽量短且宽，减小回路电感，提升瞬态能量分流效率。
- 对差分线应用时，保护器应对两条线分别布防或采用匹配的双向方案，避免不对称钳位。
- 0201 封装贴装需使用高精度贴片机，回流温控参照厂方工艺建议，防止过热或偏移。
六、可靠性与合规
- 工作温度覆盖工业级范围（-55℃ 至 +125℃），适合恶劣环境应用。
- 按 IEC 61000-4-2 进行电气静电放电抗扰度设计，适配常见接触放电与空气放电场景。
- 极低的漏电流与结电容，有助于延长系统待机时间并保持信号质量。
七、订购与注意事项
- 零件型号：TPESD0201G05V，品牌 TECH PUBLIC（台舟电子），封装 0201。
- 0201 封装对生产与检修提出更高要求，请在设计时预留合适的生产与测试工艺支持，包括贴装设备与光学检测。
- 建议在样品阶段与供应商确认钳位测试条件与实际系统兼容性，必要时进行板级 ESD 抗扰度验证。
本器件以其超低电容、低漏电、工业级温度与小尺寸封装，成为对信号完整性和空间约束要求高的电子设计中，性价比较优的 ESD 保护方案。若需更详细的电气特性曲线、封装图或回流曲线，请联系供应商获取完整规格书与应用笔记。
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