WMSIC Electronic Components

TECH PUBLIC TPAS179-92LF TPAS179

ModelTPAS179-92LF
PackageSOT-363
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPAS179-92LF
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPAS179-92LF
Electronic Component
1
Package
SOT-363
Electronic Component
3GHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.07g
Electronic Component
1
Channel Count
1
Electronic Component
BM0228740070
Operating Temperature
40℃~+85℃
Operating Voltage
3V
Switch
2:1
(ton)
50ns
(toff)
50ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPAS179-92LF 产品概述

一、概览

TPAS179-92LF 是 TECH PUBLIC(台舟电子)推出的一款高速模拟开关/多路复用器,采用 SOT-363 超小封装,针对体积受限且要求高带宽与快速切换的应用场景设计。器件为单通道 2:1(单刀双掷,SPDT)结构,工作电压 3V,开关上、关断响应时间均为 50ns,带宽可达 3GHz,工作温度范围为 -40℃ 至 +85℃,适用便携式与工业级系统。

二、主要规格(要点)

  • 开关拓扑:2:1(单通道,单刀双掷)
  • 通道数:1
  • 工作电压:3V(单电源)
  • 导通时间(ton):50ns
  • 关断时间(toff):50ns
  • 工作温度:-40℃ ~ +85℃
  • 带宽:3GHz(典型,适合宽带/射频信号)
  • 封装:SOT-363(超小型封装,节省 PCB 面积)
  • 品牌:TECH PUBLIC(台舟电子)

三、功能与优势

  • 高频宽带支持:最高 3GHz 带宽,使其可直接用于高频、射频与视频信号切换,满足高速信号路径的要求。
  • 快速切换:50ns 的上、关切换时间适用于需要快速复用或时分切换的系统,降低切换延迟对信号完整性的影响。
  • 低电压工作:3V 单电源设计,兼容常见的低功耗与电池供电系统,适合便携设备。
  • 小型化封装:SOT-363 封装在空间受限的设计中具有显著优势,便于多通道或模块化布局。
  • 宽温度范围:-40℃ 到 +85℃ 的工作温度满足工业级和消费类环境要求。

四、典型应用场景

  • 射频/宽带路径切换:天线选择、射频前端测试、RF 信号复用
  • 视频与高速数据切换:视频矩阵、摄像头信号复用、差分及单端高速信号路由
  • 便携通信设备:手持终端、蓝牙/Wi-Fi 开关与信号选通
  • 测试与测量设备:示波器通道复用、矢量网络分析前端切换
  • 传感与采集系统:多路传感器信号选择(在信号电压受限于电源范围内)

五、设计注意事项

  • 信号电压范围:模拟开关通常要求被切换信号保持在器件电源轨(VSS-VDD)范围内,超出电源轨的信号可能引起导通漏电或损坏,请在设计中限制信号摆幅或添加保护电路。
  • 电源去耦:在 VDD 处靠近器件放置适当的旁路电容(如 0.01–0.1µF),降低电源噪声对开关性能的影响,尤其在快速切换时有助于稳定控制。
  • 阻抗匹配与 PCB 布局:对于接近 GHz 级带宽的应用,应注意走线阻抗控制、短走线、避免不必要的过孔和弯折,必要时做 50Ω 匹配以减少反射。
  • 控制信号驱动:控制引脚建议直接由符合 3V 逻辑电平的驱动器驱动,确保上/关切换具有充分的电平裕度;若使用更高电压的驱动器,需要注意驱动电压不要超过器件最大额定值。
  • 热与可靠性:尽管 SOT-363 封装利于小型化,但在高频高切换率或高系统温度下应关注整体热耗散与 PCB 散热设计。
  • ESD 保护:在射频及端口频繁插拔的场景中建议增加适当的 ESD 防护元件,防止静电击穿开关结构。

六、封装与采购信息

  • 封装形式:SOT-363(超小贴片)
  • 适用场合:高密度板、便携设备、射频前端等对面积与带宽有严格要求的设计
  • 品牌与型号:TECH PUBLIC(台舟电子) TPAS179-92LF

注:本概述基于器件基础参数与典型应用经验总结。进行最终电路设计与关键性能验证(如插入损耗、隔离度、开关电阻等)时,建议参照 TPAS179-92LF 的完整规格书与典型电路图,并在目标应用板上做信号完整性与热稳定性测试。

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