WMSIC Electronic Components

TECH PUBLIC MC74VHC1G07DFT1G-TP MC74VHC1G07DFT1G

ModelMC74VHC1G07DFT1G-TP
PackageSOT-353
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC MC74VHC1G07DFT1G-TP
Type
SOT-353
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
MC74VHC1G07DFT1G-TP
Electronic Component
1
Package
SOT-353
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
VHC
Electronic Component
0.1g
Electronic Component
1
Electronic Component
1
Electronic Component
BM0265166864
Operating Voltage
2V~5.5V
Output Type
Electronic Component
Type
Electronic Component
Current(IOL)
8mA
Static Current(Iq)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC74VHC1G07DFT1G-TP 产品概述

一、简介

MC74VHC1G07DFT1G-TP 是 TECH PUBLIC(台舟电子)基于 VHC 系列工艺的单通道开漏缓冲器。器件工作电压范围宽(2.0V~5.5V),输出为开漏(open-drain),适合作为信号驱动、总线线与逻辑接口保护器件使用。器件静态电流极低,适合对功耗敏感的便携与电池供电系统。

二、主要性能指标

  • 输出类型:开漏(需外部上拉电阻)
  • 工作电压:2.0V ~ 5.5V
  • 元件数/通道:1 个器件,1 位,单向通道
  • 灌电流(IOL):8 mA(低电平驱动能力参考值)
  • 静态电流(Iq):典型 1 μA(静态功耗极低)
  • 传播延迟(tpd):约 6 ns @ VCC=5V, CL=50 pF
  • 系列:VHC(低电容、高速 CMOS)
  • 封装:SOT-353(超小型封装,适合高密度板级设计)

三、典型应用场景

  • 总线或多点线的线与逻辑级联(利用开漏实现线-与逻辑或多主总线)
  • 与 MCU/FPGA 的电平接口与隔离(注意遵循电压与钳位要求)
  • 低功耗便携设备的信号驱动与开关控制
  • 作为上拉时钟/数据线的缓冲和驱动单元(需配置合适上拉电阻)

四、设计与使用注意事项

  • 上拉电阻:由于输出为开漏,必须外接上拉电阻以产生高电平。上拉阻值需兼顾速度与电流消耗,例如在 3.3V 下若要求接近 IOL 能力,可按 R ≈ V/I 估算(仅作参考)。
  • 电源去耦:建议在 VCC 与 GND 之间靠近器件放置 0.01–0.1 μF 陶瓷去耦电容,减小瞬态干扰与延迟抖动。
  • 负载与热限制:IOL 为 8 mA,若驱动更大电流应外接驱动器或功率器件,避免长期过载导致器件发热。
  • PCB 布局:SOT-353 为超小封装,焊盘与过孔布局需遵循封装工艺,注意焊接可靠性与热回流工艺控制。
  • 可靠性与兼容性:在多电平系统中使用前确认输出允许的上拉电压与输入耐压,必要时加入限流或电平移位器。

五、封装与选型建议

SOT-353 超小封装适合空间受限的便携与模块化设计;若装配与焊接对可靠性要求较高,建议在样机阶段评估回流工艺与可焊性。选择 MC74VHC1G07DFT1G-TP 时,应结合系统电压范围、所需 IOL、速度与封装密度进行权衡;对于需要更高驱动电流或双向通道的需求,可参考同系列其他型号。

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