WMSIC Electronic Components

TECH PUBLIC ESDSLC5V0LTB-TP ESDSLC5V0LTB

ModelESDSLC5V0LTB-TP
PackageDFN1006-3
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC ESDSLC5V0LTB-TP
Type
TECH PUBLIC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
ESDSLC5V0LTB-TP
Electronic Component
1
Package
DFN1006-3
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.008g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.6pF;0.3pF
Electronic Component
BM0264595662
Operating Temperature
55℃~+125℃
Voltage
15V
Electronic Component
IEC 61000-4-5;IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
80nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESDSLC5V0LTB-TP 产品概述

一、产品简介

ESDSLC5V0LTB-TP 是台舟电子(TECH PUBLIC)推出的一款双路低容抗静电/浪涌保护二极管(TVS),面向 5V 系统的信号和接口保护。器件采用紧凑 DFN1006-3 封装,工作温度范围 -55℃ 至 +125℃,同时满足 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)和 IEC 61000-4-5(浪涌)等电磁兼容防护等级要求。

二、主要参数

  • 反向截止电压 VRWM:5V
  • 击穿电压 VBR:6.5V(典型/建议值)
  • 钳位电压 VC:15V(在指定冲击电流下)
  • 峰值脉冲电流 IPP:4A
  • 反向漏电流 IR:80nA(在 VRWM 下)
  • 结电容 CJ:0.6pF / 0.3pF(典型值,适合高速信号)
  • 通道数:双路
  • 封装:DFN1006-3
  • 工作温度:-55℃ ~ +125℃

三、功能与优势

  • 小电容设计(0.3–0.6pF),对高速数据线和接口(如 USB、SDA/SCL、差分对等)影响小,易于保持信号完整性。
  • 低漏电流(80nA),适合对待机功耗敏感的便携或低功耗系统。
  • 钳位电压 15V,配合 4A 峰值脉冲能力,可有效吸收瞬态过电压,保护下游芯片免受击穿损伤。
  • 双路结构灵活,可用于两路独立保护或差分线对的保护布置,占板面积小。

四、典型应用

  • 手机、平板及便携设备的 I/O 接口保护
  • 工业控制与传感器接口的浪涌/静电保护
  • 通讯设备、网关和路由器的端口保护
  • 汽车电子辅助系统及消费类电子产品的外部连线保护(需按系统标准验证)

五、布局与使用建议

  • 器件应尽量靠近被保护的连接器或线缆入口放置,接地端走短且粗的回流路径;
  • 单点接地优先,必要时在地层增加过孔以降低接地阻抗;
  • 对高速差分线,注意匹配阻抗并将 TVS 放置在差分线上外侧或分别保护两线;
  • 在选择器件时确认系统能承受 15V 钳位电压,必要时配合串联限流元件或选择更大功率等级的 TVS。

六、可靠性与合规

ESDSLC5V0LTB-TP 设计符合 IEC 61000-4-2、-4-4 与 -4-5 的抗扰度测试要求,具有工业级工作温度范围和低漏电特性,适合长期稳定运行的保护场合。实际系统设计中建议结合整机 EMC 测试确认保护效果。

如需完整数据手册、封装尺寸图或样品订购信息,请联系 TECH PUBLIC(台舟电子)或其授权分销渠道获取最新资料与支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.