WMSIC Electronic Components

TECH PUBLIC TPSP0505BAHTG

ModelTPSP0505BAHTG
PackageSOT-23-6
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPSP0505BAHTG
Type
TECH PUBLIC
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPSP0505BAHTG
Electronic Component
1
Package
SOT-23-6
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.042g
Electronic Component
1
Cj- Capacitor
35pF;80pF
Electronic Component
BM0264970842
Operating Temperature
55℃~+125℃
Voltage
13V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
10nA
Voltage(VBR)
5.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPSP0505BAHTG 产品概述

一、产品简介

TPSP0505BAHTG 是台舟电子(TECH PUBLIC)推出的一款低电压浪涌与静电放电(ESD)保护二极管,采用 SOT-23-6 封装,专为对电压敏感的微电子元件和高速接口设计。其反向截止电压(Vrwm)为 5.5V,击穿电压(VBR)约 5.6V,能够为 5V 类电源和 I/O 接口提供可靠的瞬态过电压保护。

二、关键参数

  • 反向截止电压(Vrwm):5.5V
  • 击穿电压(VBR):≈5.6V
  • 钳位电压(Vclamp):约 13V(在指定峰值脉冲条件下)
  • 峰值脉冲电流(Ipp):10A @ 8/20µs
  • 反向漏电流(Ir):10nA(典型低泄漏)
  • 结电容(Cj):可选 35pF 或 80pF(适配不同信号完整性要求)
  • 工作温度范围:-55℃ ~ +125℃
  • 防护等级:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)标准

三、主要特性

  • 高频响应快,能在纳秒级响应 ESD 瞬变,保护敏感芯片免受接触或空气放电损伤。
  • 低泄漏电流(10nA),在待机或低功耗应用中对系统影响极小。
  • 低封装电容(35pF/80pF 可选),可根据接口速率在保护能力与信号完整性之间权衡。
  • 紧凑 SOT-23-6 封装,占用 PCB 面积小,适合空间受限的便携设计。
  • 在 8/20µs 浪涌测试下可承受 10A 峰值脉冲,具备良好的抗浪涌能力。

四、典型应用场景

  • 智能手机、智能手表等便携式终端的 USB/数据信号线和充电接口保护。
  • 可穿戴设备、无线耳机等对体积和功耗敏感的消费电子产品。
  • 工业和医疗电子中对瞬变耐受性有要求的低压信号接口。
  • 需要兼顾高速信号和防护能力的 UART、I2C、SPI、USB2.0 等接口。

五、设计与布局建议

  • 将 TPSP0505BAHTG 靠近被保护的接头或器件放置,尽量缩短信号线到器件的距离以降低寄生电感。
  • 将器件 GND 引脚直接焊接到主地平面,并使用多处过孔(via)与底层地平面连接以降低回流路径阻抗。
  • 对高速差分线若要求极低电容,优先选用 35pF 版本;对抗干扰能力要求更高且对带宽要求较低的场合可考虑 80pF 版本。
  • 对于电源线上可能的高能量浪涌,建议与适当的熔断器或 PTC 配合使用以增强整体保护能力。

六、封装与可靠性

SOT-23-6 封装便于自动贴片和回流焊接,符合表面贴装工艺要求。器件工作温度范围宽,适应工业级至消费级环境,且通过常见电磁兼容(EMC)测试规范,可靠性满足多种应用场景的长期使用要求。

七、采购与选型说明

在选型时,请根据目标接口的工作电压、允许的最大钳位电压、信号速率以及系统对泄漏电流的限制,选择合适的结电容标称(35pF 或 80pF)。如需大批量采购或获取完整技术资料、封装尺寸图和波峰回流工艺建议,请联系 TECH PUBLIC(台舟电子)或其授权分销渠道获取原厂数据手册与样品。

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