WMSIC Electronic Components

TECH PUBLIC TPNUP4114UPXV6T1G

ModelTPNUP4114UPXV6T1G
PackageSOT-563
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPNUP4114UPXV6T1G
Type
TECH PUBLIC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPNUP4114UPXV6T1G
Electronic Component
1
Package
SOT-563
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.023g
Electronic Component
1
Cj- Capacitor
0.7pF
Electronic Component
BM0257297273
Operating Temperature
55℃~+125℃
Voltage
14V;18V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPNUP4114UPXV6T1G 产品概述

一、产品简介

TPNUP4114UPXV6T1G 是 TECH PUBLIC(台舟电子)推出的一款用于低电压信号线的瞬态抑制保护器件(ESD保护)。器件采用超小型 SOT-563 封装,专为空间受限且对信号完整性有较高要求的应用设计,能够在静电放电和雷击/浪涌等短时过压事件中迅速钳位,保护后端敏感电路不受损害。

二、主要电气参数

  • 反向截止电压(Vrwm):5 V(适用于以地为参考的 5 V 及更低电压信号线)
  • 击穿电压(Vbr):6 V
  • 钳位电压(Vclamp):约 14 V(低能量脉冲)至 18 V(高能量脉冲)
  • 峰值脉冲电流(Ipp):4 A @ 8/20 µs
  • 峰值脉冲功率(Ppp):120 W @ 8/20 µs
  • 反向漏电流(Ir):100 nA(典型,低漏电有利于高阻抗电路)
  • 结电容(Cj):约 0.7 pF(极低电容,适合高速信号线)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 抗扰与测试标准:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)及 IEC 61000-4-5(浪涌)规范要求

三、关键特性

  • 小体积封装:SOT-563 芯片级小封装,便于高密度 PCBA 布局与自动化贴装。
  • 低结电容(0.7 pF):对高速数据链路(如 USB、MIPI、LVDS 等)具有极小的信号失真和带宽影响。
  • 高瞬态吸收能力:4 A(8/20 µs)脉冲电流和 120 W 脉冲功率(8/20 µs)可吸收常见的浪涌与脉冲能量,提供短时强干扰防护。
  • 低漏电流:100 nA 的反向漏电特性确保对电源与低功耗电路的影响最小。
  • 宽温度工作范围:-55 ~ +125 ℃,适合工业级与消费级环境。
  • 满足 IEC 标准:通过 IEC-61000-4 系列测试,便于在需要合规性的系统中直接采用。

四、典型应用场景

  • 手机、平板等便携终端的 I/O 接口保护(例如按键、耳机、数据接口)
  • 高速差分或单端数据线保护(USB、MIPI、LCD 接口、摄像头线等)
  • 通信设备、路由器、交换机的端口防护
  • 工业控制与测量设备中对外部连接的过电压/静电防护
  • 消费电子与可穿戴设备的敏感引脚保护

五、封装与 PCB 布局建议

  • 尽量将器件靠近受保护的连接器或接口放置,减小寄生电感与走线长度,从而提高保护效率。
  • 保护器的地端应直接回流到稳健的地平面,必要时在地回路处布置多孔过孔(vias)以降低接地阻抗。
  • 对高速信号线建议使用最短、最直的走线,避免在保护器附近产生长环路。
  • 对于差分线应用,若为单通道保护,请确认器件对差分信号的影响(0.7 pF 对多数高速接口影响极小)。
  • 注意热量散布:虽然此类器件以瞬态功率吸收为主,但在频繁强脉冲场合下,应考虑整体热设计与散热路径。

六、可靠性与注意事项

  • 器件的钳位电压在不同能量等级的脉冲下会有所变化,典型值为 14–18 V;在选择用于某一电路时,应核对被保护器件的耐压与可承受的钳位电压范围。
  • 虽能承受短时大能量冲击,但不建议作为长期承载路径来替代浪涌吸收器或功率型保护元件。频繁的大能量冲击可能降低器件寿命或导致性能退化。
  • 在高度敏感的模拟或射频前端,尽管 Cj 很小,仍需先行评估对系统带来的相位/幅度影响。

七、选型建议

若系统为以地为参考的 5 V 或更低电压信号线,且对信号完整性与封装尺寸有较高要求,TPNUP4114UPXV6T1G 是一款兼顾性能与体积的选择。选型时重点确认钳位电压对被保护电路的安全性、脉冲承受能力是否符合现场雷击/浪涌风险评估,以及 PCB 布局能否满足低阻抗接地的要求。

总结:TPNUP4114UPXV6T1G 提供了低电容、高吸收能力与小体积三者兼顾的解决方案,适合现代便携与通信类产品对端口保护的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.