WMSIC Electronic Components

TECH PUBLIC TPESDALC6V1W5

ModelTPESDALC6V1W5
PackageSOT-353
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPESDALC6V1W5
Type
TECH PUBLIC
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPESDALC6V1W5
Electronic Component
1
Package
SOT-353
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.035g
Electronic Component
1
Cj- Capacitor
60pF;30pF
Electronic Component
BM0265085214
Operating Temperature
55℃~+125℃
Voltage
14V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
100nA
Voltage(VBR)
9V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPESDALC6V1W5 产品概述

一、产品简介

TPESDALC6V1W5 系列是 TECH PUBLIC(台舟电子)推出的小型 SOT-353 封装瞬态抑制器,专为对电压敏感的微电子器件提供静电放电(ESD)与脉冲瞬态保护。器件具有卓越的钳位能力、极低的泄漏电流和亚纳秒级响应时间,非常适合空间受限的智能手机、智能手表及各类便携/可穿戴设备。

二、主要性能指标

  • 反向截止电压 Vrwm:5V
  • 击穿电压 VBR:9V(典型)
  • 钳位电压(在指定冲击下):14V
  • 反向漏电流 Ir:100nA(典型条件)
  • 结电容 Cj:约 30pF / 60pF(视测试条件与频率而定)
  • 工作温度:-55℃ ~ +125℃
  • 防护等级:满足 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)要求

三、产品特点

  • 极快响应时间,能在瞬态发生初期吸收并钳位高幅度尖峰,保护下游敏感器件;
  • 低漏电流设计,适合对待机功耗要求高的移动设备;
  • 较低的钳位电压,减小被保护器件承受的瞬态应力;
  • 紧凑 SOT-353 封装,占用面积小,便于高密度 PCB 布局。

四、典型应用

  • 智能手机与平板的接口保护(USB、音频、按键等);
  • 智能手表、可穿戴传感器的外露引脚保护;
  • 摄像头模组与显示驱动的静电防护;
  • 各类对体积、功耗敏感的消费电子产品与便携设备。

五、布局与使用建议

为获得最佳保护效果,器件应尽量靠近被保护引脚布置,尽量缩短到地的回流路径并增设多点接地或过孔以降低寄生电感。对于高速信号线,建议评估结电容对信号完整性的影响,必要时配合串联阻抗或滤波网络。选用 SOT-353 封装时注意焊盘与冷却/接地结构的设计,以确保可靠性与重复放电能力。

TPESDALC6V1W5 在保持小尺寸的同时提供行业级的瞬态抑制性能,是对体积、功耗和抗干扰能力有严格要求产品的理想选择。若需详细电气特性曲线或参考布局,请联系 TECH PUBLIC(台舟电子)获取完整数据手册与评估板资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.