WMSIC Electronic Components

TECH PUBLIC TS3USB3000RSER-TP TS3USB3000RSER

ModelTS3USB3000RSER-TP
PackageQFN-10(1.5x2)
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TS3USB3000RSER-TP
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TS3USB3000RSER-TP
Electronic Component
1
Package
QFN-10(1.5x2)
Electronic Component
5.8GHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
1g
Electronic Component
1
Channel Count
2
Features
Isolated
Electronic Component
BM0265144648
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Switch
2:1
(ton)
7us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS3USB3000RSER-TP 产品概述

一、产品简介

TS3USB3000RSER-TP(品牌:TECH PUBLIC / 台舟电子)是一款双通道双刀双掷(2×SPDT)高带宽模拟开关,专为移动高清链路(MHL)与USB2.0高速(480Mbps)在同一USB连接器上的共享应用设计。器件在单一QFN-10(1.5×2mm)封装内集成两路开关,支持在移动平台中通过插座复用视频和数据通道,提高系统集成度与可靠性。

二、主要功能特性

  • 宽电源工作范围:VCC = 2.3V ~ 5.5V,支持多种系统电压等级。
  • 过压耐受(OVT):I/O 引脚可承受高达 5.5V 的过压条件,提高热插拔与外部电源容忍能力。
  • 断电隔离(Power-off isolation):在 VCC = 0V 或器件断电时,所有 I/O 自动进入高阻抗,且无大电流泄漏,适合电源管理严格的便携设备。
  • 故障保护:保护级别设计可减少外部故障对系统总线的影响(详见应用注意事项)。
  • 控制逻辑兼容 1.8V:允许直接与基带处理器 GPIO 驱动控制,无需额外电平转换。

三、电气性能亮点

  • 通道数:2 路(2:1 切换)
  • 导通电阻 Ron:9.5 Ω @ VCC = 2.3V(低电阻保证信号完整性)
  • 导通电容 Con:约 1.8 pF(低容性有利于高带宽传输)
  • 通断时间:导通(ton)≈ 7 μs;断开(toff)≈ 22 ns(快速断开有助于减少冲突时序风险)
  • 带宽:典型带宽 5.8 GHz,能够无失真地通过 MHL 视频与 USB2.0 高速信号
  • 工作温度范围:-40 ℃ ~ +85 ℃

四、典型应用场景

  • 智能手机、平板和平板式媒体播放器:通过单个USB接口在MHL视频与USB数据间切换。
  • 笔记本与二合一移动终端:节省接口并实现接口功能复用。
  • 车载娱乐系统与投影适配器:需要在不同模式间快速切换且保证高带宽视频传输。
  • 任何需在有限I/O上复用高速差分信号的便携式或嵌入式系统。

五、设计与选用建议

  • 电源滤波:在 VCC 端靠近封装放置去耦电容(如 0.1 μF 附近),确保控制开关稳定。
  • 控制接口:若基带 GPIO 输出为 1.8V,直接连接即可;若使用更高或更低电平,请确认电平兼容性。
  • 信号完整性:对于差分高速信号(如 USB2.0),尽量保持走线差分一致、短且阻抗匹配,避免在开关附近产生串扰。
  • ESD 和保护:尽管器件具备一定的过压耐受与故障保护,仍建议在易受静电或浪涌影响的位置使用 TVS 限压保护器。
  • 热插拔与异常条件:利用器件的断电隔离与OVT特性,可降低热插拔时对系统的风险,但需在系统层面设计合理的状态检测与切换策略,避免同时驱动冲突。

六、封装与订购信息

  • 封装:QFN-10,尺寸 1.5 × 2.0 mm,适合空间受限的移动终端板级布局。
  • 型号:TS3USB3000RSER-TP(TECH PUBLIC / 台舟电子)

七、总结

TS3USB3000RSER-TP 为需要在单一 USB 接口上实现 MHL 与 USB2.0 共享的系统提供了高带宽、低损耗、断电隔离与过压耐受的解决方案。其 1.8V 控制兼容性与紧凑封装使其非常适合空间和功耗受限的便携设备。设计时注意信号走线、供电去耦与外部保护,可以充分发挥器件在系统整合和可靠性方面的优势。

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