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TWGMC US2M
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC US2M
- Type
- TWGMC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- US2M
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.11g
- Electronic Component
- 1
- Electronic Component
- BM0228587145
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 1.65V@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US2M 产品概述
一、产品简介
US2M 为台湾迪嘉（TWGMC）生产的独立式整流二极管，采用 SMA（DO-214AC）封装，面向中高压整流与开关电源保护场景。器件强调高反向耐压与可靠的开关性能，适用于需要兼顾耐压与切换速度的电力应用。
二、主要参数
- 型号：US2M（TWGMC）
- 封装：SMA (DO-214AC)
- 正向压降：Vf = 1.65 V @ If = 2 A
- 直流反向耐压：Vr = 800 V
- 整流电流：Io = 2 A（连续）
- 反向电流：Ir = 5 μA（典型/最大值，详见资料）
- 反向恢复时间：Trr = 75 ns
- 工作结温：Tj = -55 ℃ ~ +150 ℃
三、特性与优势
- 高耐压能力（800 V），适合高压整流和能量回收线路。
- 75 ns 的反向恢复时间，使其在中等开关频率下表现良好，较适合开关电源、逆变器等场合。
- SMA 封装兼顾散热与焊接可靠性，适合手工和回流贴装。
- 反向漏电低（5 μA），在高阻态下损耗小，有利于提升效率与稳定性。
四、典型应用
- 开关电源（SMPS）高压整流与续流二极管
- 功率因数校正（PFC）电路
- 反并联作为逆变器/电机驱动的自由轮二极管
- 保护电路、极性保护与浪涌抑制（需配合能量限制元件）
五、封装与电路布局建议
- SMA 封装需保证焊盘面积与铜箔散热，建议在焊盘下方/附近布置热铜皮及过孔以导入多层铜层散热。
- 布线应尽量缩短二极管与电感、开关器件之间的走线以降低寄生电感，减少尖峰与EMI。
- 对于高压侧，注意保持足够的爬电距离和隔离，避免表面击穿。
六、热管理与可靠性建议
- 虽额定连续电流为2 A，但实际允许电流受PCB散热能力影响，应按实际铜箔和环境温度进行降额（derating）。
- 在高脉冲或浪涌工况下，关注瞬时正向峰值电流与结温上升，必要时加装散热片或采用并联/更大封装器件。
- 焊接建议遵循厂商的回流温度曲线，避免过热导致封装或内部焊点损伤。
七、选型注意事项与替代建议
- 若应用追求更低正向压降（提高效率），可考虑高压肖特基替代器件，但需权衡其反向耐压与反向漏电特性。
- 对于更高开关频率或要求更短恢复时间的场合，可选择Trr更低的超快恢复或肖特基二极管。
八、品牌与采购信息
- 品牌：TWGMC（台湾迪嘉）。采购和批量应用前建议索取完整数据手册与可靠性认证，确认测试条件（温度、电压）与典型曲线以完成电路验证。
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