WMSIC Electronic Components

TWGMC SB1045L Schottky Diode SB1045L

ModelSB1045L
PackageTO-277
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC SB1045L
Type
TWGMC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
SB1045L
Electronic Component
1
Package
TO-277
Electronic Component
Schottky Diode
Electronic Component
0.14g
Electronic Component
1
Electronic Component
BM0265082563
Current
10A
Diode
1
Current(Ir)
300uA
(Vf)
500mV@10A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SB1045L 肖特基二极管产品概述

一、产品基本信息

SB1045L是台湾迪嘉(TWGMC)推出的独立式肖特基势垒二极管,采用TO-277紧凑型封装,专为低压大电流应用场景优化设计。该型号属于功率半导体器件类别,核心优势在于低正向压降、宽工作温度范围,可满足电源转换、工业控制等领域的能效与可靠性需求。

二、核心电性能参数详解

SB1045L的参数针对低压大电流场景做了针对性优化,关键指标及实际意义如下:

1. 正向压降(Vf)

正向压降仅500mV(@10A正向电流IF),远低于普通硅PN结二极管(典型值1.0~1.2V)。低Vf可直接降低导通功率损耗(公式:(P=I_F \times V_f)),例如10A工作电流下损耗仅5W,相比传统二极管减少近50%损耗,显著提升系统能效。

2. 直流反向耐压(Vr)

直流反向耐压为45V,满足低压应用的反向阻断需求,可有效防止反向电流冲击后端电路,保障器件安全。

3. 反向漏电流(Ir)

反向漏电流典型值为300μA(额定结温下),低漏电可减少反向功率损耗,避免因漏电流导致的额外发热,提升电路长期稳定性。

4. 工作结温范围

工作结温覆盖**-55℃~+150℃**,宽温度范围可适应极端环境(如户外高温、低温严寒地区),满足工业、汽车等领域的严苛使用条件。

三、封装与物理特性

SB1045L采用TO-277封装,具备以下实用优势:

  • 紧凑型设计:符合JEDEC标准,尺寸小巧(典型值:长×宽×高≈6.5×5.5×2.3mm),节省PCB空间,适合高密度电路布局;
  • 表面贴装兼容:引脚布局适配自动化贴装设备,提升生产效率,降低人工成本;
  • 良好导热性:封装材料导热系数高,可快速将结温传导至外部,典型热阻<10℃/W,保障大电流下的长期可靠性;
  • 机械强度:封装结构坚固,抗振动、抗冲击性能优异,适合车载、工业等振动环境。

四、品牌与品质保障

TWGMC(台湾迪嘉)是专注于功率半导体的专业制造商,SB1045L继承了品牌的品质管控体系:

  • 生产过程符合ISO 9001、IATF 16949(汽车级)等国际标准;
  • 产品一致性好,参数离散性小(如Vf偏差<±50mV),可满足批量生产的稳定性需求;
  • 供货周期稳定,支持客户量产计划,无断供风险。

五、典型应用领域

SB1045L凭借低损耗、宽温、大电流特性,广泛应用于以下场景:

  1. 开关电源/DC-DC转换器:作为续流二极管或整流管,用于12V/24V低压电源,提升转换效率(可使电源效率提升3%~5%);
  2. 太阳能逆变器:微型逆变器或并网逆变器的整流电路,适应户外-40℃~+85℃的极端温度;
  3. 汽车电子:车载充电系统、LED车灯驱动、电池管理系统(BMS)的整流/续流环节;
  4. 工业控制:PLC电源、伺服驱动器电源的低压大电流模块;
  5. LED驱动电源:大功率LED驱动的整流电路,减少损耗,提升亮度稳定性。

六、选型与应用注意事项

  1. 正向电流需控制在额定值内(需参考TWGMC官方 datasheet的最大IF参数,通常为10A连续电流),避免过流损坏;
  2. 反向电压需低于45V,防止反向击穿;
  3. 高温环境下工作时,需增加散热片或优化PCB铜箔面积(建议≥10cm²),降低结温;
  4. 存储与运输需避免高温(>85℃)、高湿(>80%RH)环境,防止封装老化。

该型号凭借高性价比与稳定性能,成为低压大电流应用的主流选型之一,可有效替代同类进口器件,降低客户成本。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.