Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TWGMC SS520 Schottky Diode SS520
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC SS520
- Type
- TWGMC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- SS520
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.19g
- Electronic Component
- 1
- Electronic Component
- BM0228587147
- Current
- 5A
- Diode
- Electronic Component
- Current(Ir)
- 300uA
- (Vf)
- 850mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS520 产品概述
一、产品简介
SS520 为 TWGMC（台湾迪嘉）出品的一款独立式整流二极管，采用 SMB 封装。器件面向中功率整流与保护应用，额定直流整流电流为 5A，非重复峰值浪涌电流达 150A，具备良好的瞬态冲击能力与宽温度工作范围（-55℃ ~ +150℃），适用于工业电源、开关电源和整流桥等场合。
二、电气参数与关键性能
- 二极管配置：独立式（单只）
- 正向压降：Vf = 0.85V @ If = 5A（典型工作点）
- 直流反向耐压：Vr = 200V
- 最大整流电流：If(AV) = 5A（在合适散热条件下）
- 反向电流：Ir ≤ 300µA（在额定反向电压下，常温）
- 非重复峰值浪涌电流：Ifsm = 150A（短时冲击）
- 工作结温范围：-55℃ ~ +150℃
说明：在 5A 连续工作时器件正向功耗约为 P ≈ Vf × I = 0.85V × 5A ≈ 4.25W，需确保足够散热以控制结温与降低反向泄漏随温升的增长。
三、热管理与可靠性要点
SMB 小型封装散热能力有限，实际可承载的持续电流受 PCB 铜箔面积与热阻影响。使用建议：
- 为器件散热预留较大铜箔面积，增加焊盘面积并尽量安排底层散热铜箔；
- 必要时在焊盘处增加过孔联通多层铜层以改善热传导；
- 对于频繁浪涌或高环境温度场合，应进行电流和结温的降额设计；
- 注意反向漏流随温度上升而增长，工作环境高温时需评估漏电对电路的影响。
四、典型应用
- 开关电源与整流桥：作为输出整流或输入整流器件；
- 电机驱动与功率控制：用于免费轮回（flyback）或反向保护；
- 电源保护电路：浪涌吸收、反向保护与二极管耦合场景；
- 工业与消费类电源模块：200V 级别的电源整流与稳压应用。
五、装配与使用建议
- 焊接：遵循 SMB 封装的常规焊接工艺与温度曲线，避免长时间超温；若需详细回流参数，请参照厂家焊接说明书；
- 布局：将二极管尽量靠近热源或负载放置，减少电流回流路径电阻并利于散热；
- 浪涌处理：如系统存在较大浪涌风险，建议在电路中配合熔断器、NTC 或吸收网络共同保护；
- 测试与验证：在目标应用环境下进行温升测试、反向漏流与峰值冲击试验，验证长期可靠性。
六、采购与包装信息
- 品牌：TWGMC（台湾迪嘉）
- 型号：SS520
- 封装：SMB（表面贴装/切脚式焊接兼容）
- 订购时请留意批次、生产日期与存储条件，批量应用建议向供应商索取完整数据手册以核实电气与机械细节。
总结：SS520 在 200V 级别的中等功率整流领域表现稳健，850mV @5A 的正向压降与 150A 的短时浪涌能力，使其在多数工业与电源应用中成为经济且可靠的选择。实际设计中需重视散热布局与高温工作下的漏电与功耗影响，以确保长期稳定运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
