WMSIC Electronic Components

TWGMC SS54(SMB) Schottky Diode SS54

ModelSS54(SMB)
PackageSMB
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC SS54(SMB)
Type
TWGMC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
SS54(SMB)
Electronic Component
1
Package
SMB
Electronic Component
Schottky Diode
Electronic Component
0.19g
Electronic Component
1
Electronic Component
BM0265082572
Current
5A
Diode
Electronic Component
Current(Ir)
1mA
(Vf)
550mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS54(SMB封装)超快恢复整流二极管产品概述

一、产品基本信息

SS54(SMB封装)是台湾迪嘉(TWGMC)推出的独立式超快恢复整流二极管,专为低压中功率整流场景设计。采用SMB表面贴装封装,兼具小型化、高效率与高可靠性,广泛适配消费电子、汽车电子及工业控制等领域。

二、核心电气参数详解

该二极管的关键参数直接决定应用适配性,具体如下:

  • 正向特性:正向压降(Vf)仅550mV@5A(远低于普通硅整流管的1V以上),可显著降低导通损耗,提升电源转换效率;连续整流电流(If)达5A,满足多数中低功率设备的持续供电需求。
  • 反向特性:直流反向耐压(Vr)为40V,覆盖12V/24V等常见低压电源的反向电压要求;反向漏电流(Ir)≤1mA@Vr,反向损耗低,进一步减少发热,延长器件寿命。
  • 浪涌耐受:非重复峰值浪涌电流(Ifsm)达150A(10ms脉冲),可有效应对开机瞬间、负载突变或雷击等场景下的大电流冲击,提升系统抗干扰能力。
  • 温度范围:工作结温覆盖-55℃~+150℃,宽温设计可适应高低温极端环境(如车载冬季低温、工业现场高温)。

三、封装与物理特性

SS54采用SMB表面贴装封装,符合JEDEC标准,具备以下优势:

  • 小型化:典型尺寸为3.0mm×2.5mm×1.5mm,比传统插件封装节省70%以上空间,适配高密度PCB设计;
  • 极性明确:封装一侧带色环标记(对应阴极),便于生产时快速识别,避免反接;
  • 工艺兼容:支持自动化贴片(SMT),生产效率高,适合批量制造;
  • 耐候性:环氧树脂封装材料耐温、耐湿,符合RoHS环保要求。

四、典型应用场景

结合参数特性,SS54适用于以下核心场景:

  1. 开关电源/适配器:手机充电器、笔记本电源的二次整流环节,低Vf减少发热,提升能效;
  2. LED驱动电源:小功率LED模组、户外路灯驱动的整流,宽温与抗浪涌能力适配户外环境;
  3. 汽车电子:车载充电器、中控电源模块的整流,应对汽车启动时的瞬间电流冲击;
  4. 工业控制:小型PLC、传感器模块的电源整流,宽温范围适应工业现场高低温;
  5. 消费电子:小家电(榨汁机、加湿器)控制板电源,SMB封装节省内部空间。

五、可靠性与环境适应性

TWGMC对该器件进行了严格可靠性测试,确保长期稳定运行:

  • 耐温测试:通过150℃高温老化测试,无参数漂移;
  • 抗振动冲击:符合MIL-STD-202标准,可承受10G振动与1000G冲击;
  • 耐湿性能:经85℃/85%RH湿热测试1000小时,参数无明显变化;
  • 环保认证:符合RoHS、REACH等环保标准,无铅焊接兼容。

六、选型与使用注意事项

  1. 极性确认:安装时色环端为阴极,反接会导致器件击穿;
  2. 焊接规范:回流焊温度≤260℃(时间≤10秒),手工焊温度≤350℃(时间≤3秒);
  3. 散热设计:5A连续电流下,PCB每引脚铜箔面积建议≥10mm²,必要时增加散热焊盘;
  4. 环境防护:若在腐蚀性气体环境使用,需加涂覆层防护;
  5. 系列拓展:如需更高耐压(如60V/100V),可选择同系列SS56/SS510;如需更大电流(如8A),可考虑SF56。

该器件以高性价比、稳定性能成为低压整流场景的主流选择,适配多领域客户的不同需求。

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