WMSIC Electronic Components

TWGMC DSK24 Schottky Diode DSK24

ModelDSK24
PackageSOD-123FL
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC DSK24
Type
TWGMC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
DSK24
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0228587135
Current
2A
Diode
Electronic Component
Current(Ir)
500uA
(Vf)
550mV@2A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DSK24 产品概述

一、产品简介

DSK24 为 TWGMC(台湾迪嘉)推出的一款独立式肖特基整流二极管,采用 SOD-123FL 封装,专为低压高速整流与反向保护设计。其正向压降低、开关速度快,适用于要求效率与响应时间兼顾的电源与保护电路。典型应用包括开关电源、DC-DC 转换器、整流滤波、反向连接保护与便携式设备电源管理等。

二、主要电气参数

  • 二极管配置:独立式
  • 型号:DSK24(肖特基二极管)
  • 正向压降:Vf = 550 mV @ IF = 2 A
  • 直流反向耐压:Vr = 40 V
  • 额定整流电流:IF = 2 A(连续)
  • 非重复峰值浪涌电流:IFSM = 40 A(单次、峰值)
  • 反向电流:IR ≤ 500 µA(典型/最大值与温度有关)
  • 工作结温范围:-55 ℃ 至 +125 ℃
  • 封装:SOD-123FL(小型表面贴装)

三、性能特点与优势

  • 低正向压降:550 mV@2 A 可显著降低导通损耗,提升系统效率,特别在低压大电流场合效果明显。
  • 快速恢复与低结电容:肖特基结构提供极短的恢复时间,降低开关损耗与电磁干扰(EMI)。
  • 小型封装:SOD-123FL 有利于高密度 PCB 布局与便携设备的体积优化。
  • 良好的浪涌承受能力:40 A 峰值浪涌能力可应对启动瞬态与突发电流冲击。
  • 宽温度范围:适用于工业级温度要求的应用场景。

四、应用建议

  • 开关电源与整流输出级(尤其是低压、高效率电源)。
  • DC-DC 降压/升压转换器的整流与旁路路径。
  • 电池充放电电路与防反接保护。
  • 便携式电子、通信设备、汽车电子(需注意系统电压与环境温度对 IR 的影响)。

五、布局与热管理要点

  • SOD-123FL 虽为小型封装,但在 2 A 连续工作时仍需注意散热:在 PCB 上为阴极/阳极铺设较大的铜箔(散热铜皮)以减小结温。
  • 缩短输入/输出走线,降低寄生电感与电阻,改善浪涌及开关性能。
  • 若长期在高温或高电流工况下工作,应评估结温并适当降低额定电流或增设散热措施。
  • 焊接:遵循厂家回流温度曲线以保证焊点可靠性。

六、注意事项

  • 反向电流随结温上升明显增加,高温环境下 IR 可能显著高于室温标称值,设计上需留有裕量。
  • 若电路中存在频繁且高幅值的浪涌,应评估 IFSM 频率与能量分布,必要时并联或选择更高浪涌能力的器件。
  • 在高压突波或反向过压可能出现的场合,需配合抑制元件(TVS、电阻网络等)一并设计保护。

七、结语

DSK24 提供了在小体积下兼顾低正向损耗与良好浪涌能力的解决方案,适合对效率与体积有双重要求的电源与保护类应用。选型时应综合考虑工作电流、环境温度与散热条件,以确保长期可靠运行。若需更详细的典型曲线、封装尺寸与钳位数据,可参考 TWGMC 官方数据手册或联系渠道获取完整规格书。

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