WMSIC Electronic Components

TWGMC 2N7002K N-Channel MOSFET 2N7002K

Model2N7002K
PackageSOT-23
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC 2N7002K
Type
SOT-23
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
2N7002K
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0228587079
Operating Temperature
50℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
40pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N7002K 产品概述

一、主要参数概览

  • 器件类型:N沟增强型场效应管(MOSFET),单颗
  • 品牌/型号:TWGMC(台湾迪嘉) 2N7002K
  • 封装:SOT-23
  • 漏源电压 Vdss:60V
  • 阈值电压 Vgs(th):1.3V
  • 导通电阻 RDS(on):900mΩ @ VGS=10V, ID=500mA
  • 连续漏极电流 ID:340mA
  • 耗散功率 Pd:350mW
  • 输入电容 Ciss:40pF;输出电容 Coss:30pF;反向传输电容 Crss:10pF
  • 工作温度范围:-50℃ ~ +150℃

二、产品特点与应用场景

2N7002K 为低至中电平电压、小信号开关之用的N沟MOSFET,适合在60V耐压要求下做开关或电平转换。小封装(SOT-23)与较低寄生电容使其在高频开关、GPIO电平转换、负载侧开关、反向保护或小电流荷载驱动(继电器驱动前级、指示灯、传感器隔离等)方面表现良好。阈值电压约1.3V,便于与低压控制器配合,但其RDS(on)在10V下仍近0.9Ω,非低电阻大电流开关器件。

三、典型使用与注意事项

  • 门极驱动:为获得标称RDS(on)需接近10V的VGS;若用3.3V或5V门极驱动,应根据实际导通电阻和功率损耗评估温升与效率。
  • 散热与功耗:Pd=350mW,连续工作时需严格控制功耗(P=I²·RDS(on));在高环境温度或持续高电流场合应降额使用或选用更大功率器件。
  • 反向二极管:内置体二极管在换向时有导通损耗,适合低频或单向开关场合,高频双向开关需注意回路设计。
  • ESD与门极保护:门极容值较小但对静电敏感,建议在易损环境中加门极电阻或TVS保护。

四、封装与焊接建议

SOT-23小封装便于面贴安装(SMT),适合空间受限的电路板设计。焊盘设计应遵循厂家推荐图样以保证可靠焊接与热流散。回流焊温度曲线按通用SOT-23规范执行,在线路板布局上尽量缩短漏、源走线以降低封装引线阻抗。

五、选型提示

若应用要求较大的导通电流或在低VGS下低损耗工作,应考虑RDS(on)显著更小且Pd更高的逻辑级MOSFET。若工作电压接近60V且电流较小且需小体积、低电容特性,则2N7002K为成本与性能较平衡的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.