WMSIC Electronic Components

TWGMC BZT52C24 Zener Diode BZT52C24

ModelBZT52C24
PackageSOD-123
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC BZT52C24
Type
TWGMC
Minimum package
3000

Technical parameters

Electronic Component
TWGMC
Electronic Component
BZT52C24
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.042g
Electronic Component
1
(Zzt)
70Ω
Electronic Component
BM0265826649
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
22.8V~25.6V
Electronic Component
55℃~+150℃
Electronic Component
3000
Electronic Component
24V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C24稳压二极管产品概述

BZT52C24是台湾迪嘉(TWGMC)推出的一款小功率表面贴装稳压二极管,采用独立式配置设计,核心功能为提供稳定的24V基准电压,同时具备低漏电流、宽温工作等特性,适配多种低功耗电子电路的稳压、保护需求。

一、品牌与产品定位

台湾迪嘉(TWGMC)作为专注于分立半导体器件的本土厂商,产品覆盖稳压管、二极管、三极管等品类,以高性价比、稳定可靠性著称。BZT52C24属于该品牌BZT52系列小功率稳压管,针对消费电子、工业控制、通信设备等领域的基础稳压场景设计,无需复杂外围电路即可实现电压稳定或过压保护。

二、核心电性能参数解析

BZT52C24的电性能针对低功耗场景优化,关键指标如下:

1. 稳压值特性

  • 标称稳压值:24V(设计目标值);
  • 实际工作范围:22.8V~25.6V(覆盖±5%偏差,满足一般电路稳压需求,避免器件个体差异导致的电压波动);
  • 动态阻抗(Zzt):70Ω(阻抗越低,稳压精度越高——电流变化时输出电压波动越小,70Ω在同类型小功率稳压管中属于中等偏优水平)。

2. 反向漏电流

描述中明确反向漏电流(Ir)为[email protected](远低于常规稳压管的μA级漏电流),说明器件反向截止特性优异,未达稳压值时几乎无电流泄露,可有效降低电路静态功耗。

3. 功率与电流限制

  • 最大耗散功率(Pd):500mW(小功率封装适配,需配合限流电阻使用,避免电流过大导致过热损坏);
  • 典型工作电流控制在10mA左右(常规稳压管的工作范围,可根据电路需求调整限流电阻)。

三、封装与物理特性

BZT52C24采用SOD-123表面贴装封装(描述中明确标注),尺寸约2.0mm×1.25mm×1.0mm,具备以下优势:

  • 体积小:适合高密度PCB设计,节省电路板空间;
  • 贴装便捷:兼容常规SMT生产线,生产效率高;
  • 极性明确:封装表面有阴极标记(如色环),便于焊接识别,避免接反损坏。

四、工作环境与可靠性

BZT52C24的环境适应性较强,关键可靠性指标包括:

  • 工作结温范围:-55℃~+150℃(符合工业级温度标准,可在极端高低温环境下稳定工作,如户外设备、车载电子);
  • 存储温度:常规为-65℃~+175℃(满足仓储与运输条件);
  • 长期稳定性:经温度循环与电流冲击测试,稳压值漂移极小,保证电路长期可靠性。

五、典型应用场景

因体积小、功耗低、稳压精度适中,BZT52C24广泛应用于:

1. 低压电源二次稳压

在12V/24V主电源中,作为二次稳压器件给MCU、传感器、模拟电路提供稳定24V电压,避免主电源波动影响后级。

2. 过压保护电路

配合限流电阻使用,输入电压超24V时反向击穿导通,钳位电压在24V左右,保护后级免受浪涌、静电损坏。

3. 简单基准电压源

用于低精度模拟电路(如运放参考电压、ADC基准输入),无需集成基准源,降低电路成本。

4. 信号钳位

在RS485、UART等通信电路中,限制信号幅度在24V以内,防止过冲损坏收发器芯片。

六、使用注意事项

  1. 限流电阻设计:必须配合限流电阻(计算:R=(V_in - V_z)/I_z,V_in为输入电压,V_z=24V,I_z取10mA),避免超500mW功率;
  2. 极性识别:焊接时确认阴极(带标记端)连接方向,接反会导致器件失效;
  3. 散热考虑:高温环境下需增加PCB铜箔面积散热,避免结温超150℃。

总结:BZT52C24是一款高性价比、小体积稳压二极管,适配多种低功耗电路的稳压与保护需求,尤其适合消费电子、工业控制等批量应用,是替代同类进口器件的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.