Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TWGMC MB30M Bridge Rectifier MB30M
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC MB30M
- Type
- TWGMC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- MB30M
- Electronic Component
- 1
- Package
- UMSB
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.35g
- Electronic Component
- 1
- Electronic Component
- BM0265082578
- Current
- 3A
- Current(Ir)
- 5uA
- (Vf)
- 1.1V@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB30M 产品概述
一、产品简介
MB30M 为 TWGMC（台湾迪嘉）出品的单相整流二极管，UMSB 封装，额定整流电流 3A，直流反向耐压 1kV，适用于中低频电源整流与一般工业整流场景。器件工作结温范围宽 (-55℃~+150℃)，适应性强，可靠性高。
二、主要参数（典型值）
- 正向压降 Vf：1.1V @ 3A
- 直流反向耐压 Vr：1000V
- 平均整流电流 Io：3A
- 反向漏电流 Ir：5µA @ 1kV
- 非重复峰值浪涌电流 Ifsm：80A（单次半正弦）
- 工作结温：-55℃ ~ +150℃
- 类型：单相整流，封装：UMSB
三、电气与散热要点
在额定电流 3A 条件下，器件正向耗散近似 P = Vf × I = 1.1V × 3A ≈ 3.3W，需合理设计 PCB 铜厚与散热路径或采用散热片，以保证结温在安全范围内。Ifsm=80A 表明对一次性浪涌（如整流桥启动、电容充电）有良好承受能力，但应避免重复峰值冲击。反向漏电小（5µA@1kV），适合高压整流场合。
四、典型应用
- 开关电源与线性电源整流
- 功率整流桥、续流二极管、逆变器输入整流
- 工业电源、电机驱动与充电器高压段整流
- 高压电路中要求较高 Vr 与中等电流的场合
五、选型与注意事项
若电路对快速恢复或低正向压降有更高要求，可考虑快恢复二极管或肖特基器件；但在 1kV 以上电压与 3A 等级的可靠高压整流，MB30M 在成本与耐压间具有平衡。设计时务必参考厂方完整数据手册进行结温、热阻与回流焊工艺限制的校核。
六、封装与可靠性建议
UMSB 封装便于手工与波峰/回流焊接，装配时注意极性标识；遵循厂方推荐的焊接曲线避免超温。长期可靠性与寿命与结温、浪涌次数及环境湿度有关，设计中应留有温度余量并避免反复超过 Ifsm 的浪涌。
总体而言，MB30M 是一款面向中等电流、高电压整流的通用二极管，适用于工业电源和高压整流场合，具有良好的耐压与浪涌能力。欲获取完整电气特性曲线与封装尺寸，请参考 TWGMC 官方数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
