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TWGMC RB520S-30 Schottky Diode RB520S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC RB520S-30
- Type
- TWGMC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- RB520S-30
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0228587142
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 1uA@10V
- (Vf)
- 600mV@200mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB520S-30 产品概述
一、产品概况
RB520S-30 是台湾迪嘉（TWGMC）推出的一款独立式肖特基整流二极管，封装为超小型 SOD-523。器件针对小电流、低压降整流和快速切换应用优化，标称正向压降为 0.6V（在 If = 200mA 条件下），直流整流电流 200mA，反向耐压 30V。其体积小、导通电阻低、响应快，适合移动设备、接口保护及高密度 PCB 的使用场景。
二、主要电气参数
- 型号：RB520S-30（TWGMC / 台湾迪嘉）
- 正向压降 Vf：0.6V @ If = 200mA
- 直流整流电流 If(AV)：200mA（连续）
- 非重复峰值浪涌电流 Ifsm：1A（单次脉冲，非重复）
- 反向耐压 Vr：30V
- 反向漏电流 Ir：1µA @ Vr = 10V（典型测试条件）
- 配置：独立式肖特基二极管
三、封装与机械特性
RB520S-30 采用 SOD-523 超小封装，适合高密度贴装场景。SOD-523 的优势在于占板面积小、引脚间距短，利于小型化产品设计；但也意味着热阻较大，长期大电流工作时需重视散热设计与环境温度对器件性能（如反向漏电流、正向压降）的影响。
四、典型应用
- 移动终端与便携式设备的电源整流与保护
- USB/数据接口反向保护与整流
- 基站、通讯模块的小功率整流电路
- 高密度电路板上的旁路、钳位或整流用途
五、使用建议与注意事项
- 电流和温度降额：在接近额定电流或高环境温度下，应按厂方建议进行降额使用，防止正向压降上升与反向漏电增长。
- 浪涌保护：Ifsm = 1A 为非重复峰值脉冲能力，仅用于瞬态冲击。对于频繁或较大浪涌，应选用更高能量的器件或增加散热/限流措施。
- 布局与散热：尽量缩短走线、增大铜箔面积或采用散热通孔，以改善热阻。SOD-523 的小体积要求谨慎评估长期功耗下的结温。
- 焊接工艺：遵循厂方 SMD 焊接与回流温度曲线，避免过度加热造成封装或内部结构损伤。
- 反向电压与漏电流：长期在高 Vr 条件下工作会使 Ir 随温度上升显著增加，应在系统层面评估漏电对功能的影响。
六、选型与备选建议
RB520S-30 适合需要低正向压降和低电流整流的便携与接口电路。如果应用存在更大连续电流、频繁浪涌或更高反向电压要求，可考虑同厂或其他厂商的更高电流/更高 Vr 的肖特基型号。购买时请确认完整规格书（Datasheet）以获取更详细的热参数、封装尺寸和回流曲线。
如需我帮您查找完整 Datasheet、封装尺寸图或针对具体电路的选型建议，可提供应用场景与电气条件，我会进一步分析。
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