WMSIC Electronic Components

TWGMC BZT52C22 Zener Diode BZT52C22

ModelBZT52C22
PackageSOD-123
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC BZT52C22
Type
SOD-123
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
BZT52C22
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.042g
Electronic Component
1
(Zzt)
55Ω
Electronic Component
BM0226536271
Diode
1
Current(Ir)
10.1uA
Power Dissipation(Pd)
500mW
Electronic Component
20.8V~23.3V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C22 产品概述

BZT52C22 为独立式稳压二极管(Zener),适用于小功率稳压、基准电压和浪涌/过压钳位等场合。该型号由台湾迪嘉(TWGMC)提供,采用 SOD-123 小型封装,兼顾体积与热散能力,适合表面贴装自动化生产线。

一、主要参数概览

  • 标称稳压值(Vz):22 V
  • 稳压值范围:20.8 V ~ 23.3 V
  • 最大耗散功率(Pd):500 mW(在规定环境/散热条件下)
  • 动态阻抗(Zzt):55 Ω(典型值,测试条件见厂方数据表)
  • 反向漏电流(Ir):典型 10.1 µA(具体测试电压/温度见数据表);在 15.4 V 条件下可测得低至 100 nA(特定测试条件)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-123(表面贴装)
  • 品牌:TWGMC(台湾迪嘉)

二、器件特性与优势

  • 小型 SOD-123 封装:体积小、适合高密度 PCB 布局,支持回流焊与自动贴装。
  • 稳定性与温度范围宽:适合工业温度等级应用(-55~+150 ℃)。
  • 典型低漏电与中等阻抗:在中低电流工作点下可提供较稳定的参考电压;Zzt=55 Ω 表明在规定测试电流下,稳压点的动态变化受控。
  • 低功耗设计:500 mW 的耗散能力适合小功率稳压/基准场景,体积、成本与性能达到平衡。

三、典型应用场景

  • 小功率基准电压源与辅助稳压(例如为模拟电路、参考电路提供稳压)
  • 电压钳位与过压保护(限制瞬态或防止输入电压超过敏感元件耐压)
  • 电平转换与偏置电路(作为简单易用的电压源)
  • 通用电子设备、仪表、通信接口电路中的局部稳压与保护

四、设计与使用建议

  • 最大稳压电流估算:Iz_max ≈ Pd / Vz = 0.5 W / 22 V ≈ 22.7 mA。该值为器件在理想散热条件下的极限稳压电流,实际使用中应留余量并根据 PCB 散热能力做降额。
  • 常见工作电流:为兼顾稳定性与寿命,建议工作电流通常选择在数百微安至几毫安范围,若需更低噪声或更精确参考可选择更稳定工作点或外加缓冲放大。
  • 偏置电阻计算示例:若输入电压 Vin=30 V,目标稳压 Vz=22 V,期望 Zener 电流 Iz=5 mA,则 R = (Vin - Vz) / Iz = 8 V / 5 mA = 1.6 kΩ;此电阻需额定能承受相应功耗 P = (Vin - Vz) * Iz = 8 V * 5 mA = 40 mW(选择安全裕度)。
  • 热管理:在高环境温度或紧凑布局下,应对 Pd 做降额并考虑加大铜箔、散热面或采用外部散热手段,避免长期在极限功耗下工作以延长寿命。
  • 焊接与加工:SOD-123 支持常规回流焊,遵循无铅回流温度曲线与厂商推荐的焊接曲线以避免热应力损伤。

五、封装与可靠性

  • SOD-123 为常见小型表贴封装,良好的机械强度和焊接可靠性,适合量产自动化贴装与回流焊工艺。
  • 结温与功耗管理是保证长期可靠性的关键。长期在高功耗、高温条件下工作会加速漂移与老化,应在设计阶段合理预留热裕度。

六、选型与订购建议

  • 订购时请明确:型号 BZT52C22、品牌 TWGMC、封装 SOD-123,并向供应商确认详细的电气测试条件(如 Zener 测试电流 Iz、漏电流测试电压与温度),以确保实际参数满足应用需求。
  • 若需更低噪声、更高精度或更大功率,应考虑同系列其他型号或不同封装/性能等级的稳压二极管。

使用 BZT52C22 时,合理选择工作点、留足热裕度并按厂方数据表确认测试条件与极限值,可在小功率稳压与保护应用中获得稳定可靠的性能表现。

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