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TWGMC SS32 Schottky Diode SS32
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC SS32
- Type
- TWGMC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- SS32
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.105g
- Electronic Component
- 1
- Electronic Component
- BM0226538440
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 500uA
- (Vf)
- 550mV@3A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS32（TWGMC）产品概述
一、产品简介
SS32 为台湾迪嘉（TWGMC）供应的独立式肖特基二极管，采用 SMA 封装，额定整流电流 3A，反向耐压 20V。该型号以低正向压降和快速响应为主要特性，适用于整流、反并联保护、开关电源和功率管理等场景。工作结温范围宽，适应多种工业与消费电子应用环境。
二、主要技术参数
- 型号：SS32
- 品牌：TWGMC（台湾迪嘉）
- 封装：SMA（独立式贴片/插件适配）
- 整流电流（If）：3A（DC）
- 直流反向耐压（Vr）：20V
- 正向压降（Vf）：≈0.55V @ 3A
- 反向电流（Ir）：≤500μA（在额定 Vr 条件下）
- 工作结温（Tj）：-55℃ ~ +125℃
三、特性与优势
- 低正向压降：Vf≈0.55V@3A，相较于普通硅整流器能显著降低导通功耗，提升能效并减少发热。
- 高整流能力：额定 3A 直流整流电流，可满足中等功率供电与电流旁路需求。
- 宽工作温度：-55℃~+125℃，适合工业级温度环境。
- 小型封装：SMA 封装体积小，便于 PCB 布局和空间受限场合的应用。
- 快速响应：肖特基结构固有的低存储电荷，使其在开关电源和高频整流中表现优异。
四、典型应用场景
- 开关电源（开关二极管、输出整流）
- 反并联与反接保护（防止反向电流损坏电路）
- 电池充放电路径控制和低压电源管理
- 功率模块、马达驱动和车载电子低压部分
五、封装与可靠性提示
SMA 为常用的小型封装，具备一定散热能力但热阻相对较高。实际使用时建议在 PCB 上增加焊盘铜箔面积以改善散热，必要时与散热铜箔或散热器配合。注意焊接工艺参数，避免超出封装和材料的温度限制，参照 TWGMC 的标准焊接曲线进行回流焊或手工焊接。
六、使用注意事项
- 反向漏电随温度升高而显著增加，需在高温工况下评估漏电对电路的影响。
- 在高于环境温度或持续大电流工作时，应按热阻与降额曲线进行电流降额设计。
- 并联使用需注意电流均分问题，宜采用电阻分流或热设计优化。
- 若需更高耐压或更低漏电，可考虑其他型号或增加串联方案。
七、选型建议
若应用要求低压大电流整流、追求更低导通损耗且工作电压不超过 20V，SS32 是经济且可靠的选择。在设计前请参考 TWGMC 官方数据手册确认详细的电气特性曲线、热阻与焊接说明，以便进行热设计与可靠性验证。
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