WMSIC Electronic Components

TWGMC SS8550W PNP Transistor SS8550W

ModelSS8550W
PackageSOT-323
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC SS8550W
Type
TWGMC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
SS8550W
Electronic Component
1
Package
SOT-323
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0226538431
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS8550W 产品概述

一、产品简介

SS8550W 是一款小型封装的通用 PNP 晶体管,由 TWGMC(台湾迪嘉)生产,采用 SOT-323 封装,适合于表面贴装的低功耗开关与小信号放大场合。器件在宽温度范围内工作可靠,可用于便携设备、音频放大、驱动与电平转换等应用。

二、主要参数

  • 晶体管类型:PNP
  • 直流电流增益 hFE:120(测试条件 Ic = 100 mA,Vce = 1 V)
  • 集电极电流 Ic:1.5 A(峰值能力,使用时需参照功耗限制)
  • 集电极耗散功率 Pd:200 mW
  • 集射极击穿电压 Vceo:25 V
  • 集电极截止电流 Icbo:100 nA
  • 特征频率 fT:100 MHz
  • 集射极饱和电压 VCE(sat):500 mV(典型)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-323(小尺寸表面贴装)

三、性能特点

  • 小体积(SOT-323)适合高密度 PCB 布局,节省空间。
  • hFE 在中等偏流(100 mA)下仍保持较高增益,适合小信号放大与驱动级。
  • fT 约 100 MHz,适用于低到中频带的信号放大与开关应用。
  • 低漏电流(Icbo 100 nA)有利于高阻抗电路和低静态功耗设计。
  • 宽温度范围保证在工业级温度条件下稳定工作。

四、典型应用场景

  • 便携式设备中的高端开关或电源管理(用作高侧 PNP 开关)
  • 小信号放大器与前级放大,尤其是需要 PNP 器件的互补对称电路
  • 音频放大器的驱动级或偏置网络
  • 逻辑电平转换、微控制器外围驱动与低压继电器/LED 驱动(注意功耗限制)

五、使用与热管理建议

  • 虽然 Ic 峰值可达 1.5 A,但器件功耗 Pd 仅 200 mW,连续大电流工作时必须控制 Vce 以防止过热。功耗计算请遵循 Pd ≥ Vce × Ic。
  • 在作为开关使用时,确保基极有足够的驱动电流并串联合适的限流电阻以保护基极。
  • 对于线性放大应用,应关注热跑逸与偏置稳定,必要时增加散热或降低工作点电流。
  • SOT-323 为塑封小尺寸封装,焊接时采用推荐的回流焊曲线与合理的铜箔热设计,以保证可靠的焊点和热散能力。
  • 长期储存与焊接请遵守厂商的湿敏等级(MSL)与回流温度规范。

六、封装与订购信息

  • 封装形式:SOT-323(表面贴装)
  • 品牌:TWGMC(台湾迪嘉)
  • 在选型时,请确认应用对连续功率、峰值电流和饱和压降的要求,必要时参考完整数据手册以获取详细极限值、典型特性曲线及焊接规范。

总结:SS8550W 是一款针对空间受限、要求中等增益与中频特性的 PNP 小信号晶体管,适用于多种通用开关与放大电路。设计时应重点考虑功耗与散热约束,合理安排驱动与偏置,以发挥其最佳性能。

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