WMSIC Electronic Components

TWGMC 78M05 Voltage Regulator 78M05

Model78M05
PackageTO-252
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC 78M05
Type
TWGMC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
2V@(500mA)
Electronic Component
TWGMC
Electronic Component
40uV
Electronic Component
78M05
Electronic Component
1
Package
TO-252
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.46g
Electronic Component
1
Electronic Component
BM0230007225
Operating Temperature
20℃~+85℃@(Tj)
Operating Voltage
20V
Output
Electronic Component
Output Voltage
5V
Output Current
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

78M05 固定 5V 线性稳压器(TWGMC,TO-252 封装)

一、产品概述

78M05 为 TWGMC(台湾迪嘉)生产的固定输出型线性稳压器,输出为正极 5.0V,单路输出、固定型设计,封装为 TO-252(DPAK)。器件适用于对稳压精度、抑制电源纹波和可靠性有一定要求的中小电流供电场合,内置短路保护与过热保护,便于在工业与民用电子产品中稳定供电。

二、主要参数与特性

  • 工作电压(输入):最高可达 20V(器件耐压能力);实际使用需考虑压差与散热。
  • 输出电压:5.0V(固定)。
  • 输出电流:最大 1A(连续);典型压差 2V @ 500mA(非低压差器件)。
  • 静态电流(Iq):约 6mA(无负载时消耗)。
  • 电源纹波抑制比(PSRR):80dB @ 120Hz(对市电纹波抑制效果优良,适合音频与模拟电路)。
  • 输出噪声:约 40µV(低噪声特性)。
  • 保护功能:短路限流保护与热关断保护,提升系统可靠性。
  • 工作温度范围:-20℃ ~ +85℃(以结温 Tj 标注,实际应用中需考虑器件自发热)。

三、典型电气特性与使用要点

  • 由于在 500mA 时压差约 2V,器件并非 LDO,输入电压最低需保证 Vout + 压差(例如欲 500mA 输出,Vin ≥ 7V)。在 1A 工作时功耗显著,应尽量将 Vin 靠近 Vout 以降低功耗。
  • 纹波抑制与低噪声适合对模拟前端和数字逻辑供电同时有要求的系统。
  • 静态电流 6mA 在电池供电场合应纳入待机功耗预算。

四、散热与热管理

  • TO-252 为表面贴装带散热片引脚形式,金属散热片/焊盘面积直接影响热阻与热性能。
  • 功耗计算:P = (Vin − 5V) × Iout。例如 Vin=12V、Iout=0.5A 时 P=3.5W,需合适铜箔面积或外接散热措施。
  • 在高功率或高环境温度下,注意热关断动作,推荐进行热仿真与实际测温验证,并按需增加散热铜箔或使用外部散热片。

五、外围电路与布局建议

  • 输入端建议并联一个 0.33µF(或 1µF)陶瓷与 10µF 电解/钽电容做瞬态与低频滤波;输出端建议 0.1µF 陶瓷+10µF 钽电容以保证稳态与瞬态响应。具体电容值请参考器件数据手册。
  • 电容应靠近器件引脚放置,减少引线/走线阻抗。
  • 地线采用完整地平面,输入/输出走线最短且尽量分开,避免热流干扰敏感信号。
  • 为降低 EMI,必要时在输入端加 LC 滤波或串联阻抗元件。

六、典型应用场景

  • 工业控制模块、嵌入式单板(为 MCU、传感器供电);
  • 通信终端与基础模拟电源;
  • 音频前端及测量仪表(得益于高 PSRR 与低噪声);
  • 电源管理模块与电池供电设备(需注意静态电流与热耗)。

七、封装与选型建议

  • TO-252(DPAK)适合表贴工艺,便于自动化生产,同时提供合理的散热通道;焊盘设计应参考厂商推荐图样以保证热阻最小化。
  • 选型时请确认实际工作电流与输入电压范围,若工作电流或 Vin−Vout 较大,考虑更低压差或开关式稳压器以提高效率并减小散热负担。
  • 最终设计前务必参照 TWGMC 官方数据手册以确认典型特性与极限参数,进行功耗与热分析验证。

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