WMSIC Electronic Components

TWGMC SI2301 P-Channel MOSFET SI2301

ModelSI2301
PackageSOT-23
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC SI2301
Type
TWGMC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
SI2301
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0092040603
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V
Capacitor(Ciss)
405pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2301 产品概述

一、产品简介

SI2301是一款由TWGMC(台湾迪嘉)制造的N沟道增强型场效应晶体管(MOSFET),其采用SOT-23封装,特别适用于低功耗、高效率的开关电源、负载开关、过流保护以及其他应用场景。得益于其出色的电气性能,SI2301在电子电路设计中获得了广泛应用,成为了许多设计工程师的首选元件之一。

二、主要规格

  1. 封装类型:SOT-23

    • 紧凑的封装设计使得SI2301能够在有限的空间内集成成更小型的电路板,适合现代电子设备的设计要求。
  2. 型号:SI2301

    • N沟道增强型MOSFET,适合在低电压和高电流的电路中使用。
  3. 最大漏极源极电压(Vds):20V

    • 适合在相对低电压的应用中使用,能有效防止器件在工作时因过压而损坏。
  4. 最大漏极电流(Id):3.4A(在25°C环境温度下)

    • 能够支持较高的负载电流,适用于要求稳定电流输出的场合。
  5. 最大功耗(Pd):1.25W(在25°C环境温度下)

    • 在设计时需要考虑散热问题,以确保晶体管在高功率时也能正常工作。
  6. 开关速度:高

    • 能够迅速地进行开和关的切换,适合高频开关电源等应用。
  7. 栅极阈值电压(Vgs(th)):1V—2V

    • 这个低阈值电压使得SI2301在较小的栅极驱动电压下也可以稳定开启,有利于降低控制电路的功耗。

三、应用领域

SI2301的设计使其广泛适用于以下应用领域:

  1. 开关电源

    • 在AC-DC电源转换、DC-DC升降压电源等各种开关电源中,SI2301能够提供高效的开关控制,提升电源的转换效率。
  2. 负载开关

    • 可用于控制电流的开关,保护其他元件免受过载和短路故障的影响。
  3. 电动机驱动

    • 在电动机控制应用中,SI2301可以用于驱动直流电机或无刷电机,提供平稳的控制和高效的驱动能力。
  4. 过流保护电路

    • 作为过流保护一个重要环节,SI2301的使用可以帮助防止电路组件在过流情况下的损坏。
  5. LED驱动器

    • 用于LED照明应用的电源设计中,SI2301可以提升LED驱动电路的效率与性能。

四、特性与优势

  1. 低导通电阻(Rdson)

    • 低导通电阻特性意味着更小的功率损耗,帮助提升整体能效。
  2. 优良的热性能

    • SI2301在高负载运作时表现出的良好热稳定性,能够在高温环境中继续可靠运行。
  3. 小型化设计

    • SOT-23的小型封装使得此器件非常适合现代便携式设备的设计需求,可以降低PCB的占用空间。
  4. 易于驱动

    • 由于其较低的栅极驱动电压,SI2301可以方便地与各类微控制器或数字信号处理器配合使用。

五、总结

SI2301是TWGMC推出的一款性能卓越的N沟道增强型MOSFET,其小型化封装、高效率和广泛的应用潜力使其成为当今电子设计中不可或缺的元件。凭借其在消耗功率、开关速度和应用灵活性上的优势,SI2301在各类现代电子产品中都得到了充分的应用,特别是在开关电源和负载开关等场景中体现出色的性能。无论是对于专业的电子工程师,还是学习阶段的学生,SI2301都提供了一个值得深入研究的对象。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.