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TWGMC ES1J Fast Recovery Rectifier ES1J
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC ES1J
- Type
- TWGMC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- ES1J
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.111g
- Electronic Component
- 1
- Electronic Component
- BM0226538288
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 1.3V@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES1J 产品概述
一、产品简介
ES1J 为 TWGMC（台湾迪嘉）品牌的独立式快恢复/高效率整流二极管，封装为 SMA（表面贴装）。该器件面向高压整流与高频开关场合，提供可靠的单向整流能力与较短的反向恢复时间，适合开关电源、驱动电路与高压保护应用。
二、主要参数与电气特性
- 直流平均整流电流（IF(AV)）：1 A（封装和环境相关需降额使用）
- 直流反向耐压（VR）：600 V
- 正向压降（典型）：1.7 V @ 1 A（正向压降随电流、温度变化，设计时请参照厂方曲线）
- 非重复峰值浪涌电流（IFSM）：30 A
- 反向恢复时间（Trr）：≈35 ns（快恢复特性，减少开关损耗）
- 反向电流（IR）：约 5 μA（在额定反向电压下）
- 工作结温范围：-55 ℃ ～ +150 ℃
三、封装与热特性
SMA 封装体积小、适合自动贴片与回流焊，适合 PCB 密集布局。由于封装体积与散热面积有限，连续较大电流时需配合合理铜箔散热、铜柱或散热铜面设计，并遵循厂方结温/环境温度降额曲线，确保长期可靠性。
四、性能优势
- 快恢复（Trr ≈35 ns）：在开关频率较高的电源中能显著降低反向恢复造成的额外损耗与振铃。
- 高耐压（600 V）：适合中高压整流、阻断高侧电压冲击。
- 峰值抗冲击能力强（IFSM 30 A）：能够承受启动或短时浪涌电流。
- 低反向漏电：在高压应用中可降低静态损耗与漏电导致的问题。
五、典型应用
- 开关电源（SMPS）次级整流或高压整流
- 反激/正激变换器的输出/回复二极管
- 电机驱动的自由轮/吸收回路
- 功率因数校正（PFC）与高压电源保护
- 需要小体积且耐压高的整流场合
六、典型电路与选型建议
- 作为输出整流器：建议在二极管旁并联适当滤波电容，必要时使用 RC 或 RCD 吸收抑制反向恢复引起的尖峰。
- 在高开关频率或要求更低正向压降场合，可比较快恢复与肖特基二极管的折衷，若需更低 Vf 可选肖特基，但其耐压通常较低。
- 对浪涌或反复脉冲，应注意 IFSM 与结温限制，必要时并联或选用更大封装器件。
七、可靠性与注意事项
- 焊接：遵循厂方回流焊曲线，避免过高温度和长时间回流以防封装应力。
- 热管理：保证良好 PCB 散热设计，并在高环境温度下进行电流降额。
- ESD 与浪涌保护：在敏感电路中增加抑制措施，避免超出 Ifsm 与 Vr 的瞬态冲击。
- 读取完整数据手册获取详细曲线（Vf–If、Ir–Vr、Trr 波形与结温降额表）。
八、结论与采购提示
ES1J（TWGMC，SMA 封装）是一款针对中高压、要求快恢复的通用整流二极管，适用于多种高频开关与整流场景。采购时请确认器件完整型号、包装形式与最新数据手册，以便在实际电路中进行热设计与电气降额确保长期稳定运行。
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