WMSIC Electronic Components

TWGMC LM2576S-5.0 Converter LM2576S

ModelLM2576S-5.0
PackageTO-263-5
BrandTWGMC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TWGMC LM2576S-5.0
Type
TWGMC
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TWGMC
Electronic Component
LM2576S-5.0
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.04g
Electronic Component
1
Type
Electronic Component
Electronic Component
BM0230007222
Operating Temperature
40℃~+125℃
Operating Voltage
7V~40V
Switching Frequency
52kHz
Electronic Component
Electronic Component
Output Voltage
5V
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2576S-5.0 产品概述

一、产品简介

LM2576S-5.0 是一款降压(Buck)型开关稳压器,提供固定 5.0V 输出,最大持续输出电流 3A,适用于中低功率车载、电源模块和嵌入式设备等场景。该器件集成功率开关、误差放大与保护电路,工作频率约为 52kHz,输入电压范围宽(7V ~ 40V),适配多种电源环境。封装为 TO-263-5(常见的贴片大功率封装),器件工作温度范围为 -40℃ ~ +125℃,静态电流(Iq)约 10mA,适合对效率和散热有较高要求的设计。

二、主要性能亮点

  • 固定输出:5.0V 输出类型,便于系统直接供电,无需外部反馈网络调整。
  • 高电流能力:最大输出电流可达 3A,支持较大负载瞬变。
  • 宽输入电压:7V ~ 40V 宽输入范围,适合汽车、工业电源或多电源轨系统。
  • 开关频率:约 52kHz,在效率与外部被动元件体积间取得平衡。
  • 保护机制:常见的内部热关断与限流保护,提升系统可靠性。
  • 低静态电流:静态工作电流约 10mA,有助于待机能耗控制。

三、关键电气参数(基于基础参数)

  • 功能类型:降压型(Buck)
  • 输入电压:7V ~ 40V
  • 输出电压:固定 5.0V
  • 最大输出电流:3A
  • 开关频率:52kHz
  • 工作温度:-40℃ ~ +125℃
  • 输出通道数:1(单路)
  • 拓扑结构:降压
  • 静态电流(Iq):约 10mA
  • 封装:TO-263-5
  • 品牌示例:TWGMC(台湾迪嘉,或同类制造商替代)

四、典型应用场景

  • 汽车电子低压轨供电(需配合滤波与抗干扰设计)
  • 工业控制与PLC 的从电源
  • 嵌入式主板、通信设备及模块电源
  • 电池供电系统的降压转换
  • 各类点阵、显示与外围电路的 5V 供电

五、设计要点与实用建议

  • 稳定性与滤波:建议在输入端使用低 ESR 电解/固态电容以抑制瞬态,输出端采用低 ESR 电容(电解+陶瓷并联)以降低输出纹波与提升瞬态响应。
  • 整流二极管:使用额定电流≥3A 的肖特基二极管,尽量选择低正向压降与快速恢复器件,靠近芯片布置以减少回流环路。
  • 电感选型:电感需具备足够的电流承载能力和饱和电流裕量(高于最大输出电流),并优先选择低 DCR 以减少铜耗。电感值可按经典公式估算:L = (Vin - Vout) * Vout / (Vin * ΔI * fs),其中 ΔI 建议取输出电流的 20%~40%。
  • 开关与布局:布线尽量短而粗,输入电容尽量靠近器件 VIN 与 GND 引脚放置,回流环路面积越小越好,以降低 EMI。将功率器件与散热铜箔充分连接,利于热量扩散。
  • 热设计:在高输入压差和高负载下,芯片会产生显著功耗。TO-263-5 封装需配合大面积 PCB 铜箔或额外散热器,必要时估算结温并保留热裕度。
  • 保护与软启动:尽量参考制造商典型应用电路接入必要的软启动、开关控制(若需要开/关功能)与滤波器件,避免启动冲击电流或输出过冲。

六、性能与可靠性注意事项

  • 效率受输入电压、输出电流与外部元件选择影响,在中高输入电压差时效率下降较明显;建议在设计阶段进行热平衡与效率仿真。
  • 在汽车或工业噪声环境,需额外考虑电磁兼容(EMC)设计:输入侧加 TVS 或滤波,输出侧加 LC 滤波以及合适的接地策略。
  • 长期可靠性依赖于电容温升与电感饱和特性,优先使用耐高温、低 ESR 的电解或固态电容,并在器件工作温度上保持裕度。

七、封装与选型提示

  • 封装:TO-263-5(适合波峰/回流焊或手工焊接,需布局热域)
  • 选型:在替换或采购时,注意确认器件为固定 5.0V 输出版本(LM2576S-5.0),并核对制造商的原始数据手册与典型应用电路,以确保外部元器件选型与 PCB 布局一致,从而实现稳定、可靠的 5V/3A 输出。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.