Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TWGMC BAS316 Switching Diode BAS316
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TWGMC BAS316
- Type
- TWGMC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TWGMC
- Electronic Component
- BAS316
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0226536210
- Current
- 250mA
- Diode
- 1
- Current(Ir)
- 30nA
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS316 产品概述
一、产品简介
BAS316 为独立式小信号快速整流/开关二极管，采用 SOD-323 表面贴装封装，由台湾品牌 TWGMC（台湾迪嘉）推出。器件适用于高频信号处理、保护电路与低功率整流场合，具有快速恢复、低反向漏电流与宽工作结温范围等优点。
二、主要性能参数
- 二极管配置：独立式
- 正向压降 (Vf)：1.25 V @ 150 mA
- 整流电流 (If)：250 mA（连续）
- 非重复峰值浪涌电流 (Ifsm)：4 A（脉冲）
- 直流反向耐压 (Vr)：100 V
- 反向电流 (Ir)：30 nA（典型/测试条件见规格书）
- 反向恢复时间 (Trr)：4 ns
- 耗散功率 (Pd)：200 mW
- 工作结温 (Tj)：-65 ℃ ~ +150 ℃
- 封装：SOD-323
三、器件特点
- 100 V 的反向耐压适用于中高压信号路径。
- 4 ns 的反向恢复时间适合高速开关与脉冲应用，减少开关损耗与干扰。
- 低反向漏电（nA 级），适合高阻抗或漏电敏感电路。
- SOD-323 小体积，利于高密度 SMT 布局与微型化设计。
四、典型应用场景
- 高频/高速开关电路与脉冲整流。
- 信号钳位、保护与禁止反向电流场合。
- 通信设备、消费电子、便携设备的低功耗信号路径。
- 反向极性保护与瞬态抑制（需根据能量要求评估）。
五、封装与装配建议
SOD-323 为常见小型 SMT 封装，兼容标准回流焊工艺。焊盘设计应参考厂商封装图，保证良好热散与焊接可靠性。由于 Pd 仅 200 mW，需在 PCB 设计中通过合理铜箔面积与热沉路径进行功耗管理。
六、使用注意事项
- 连续工作电流不宜长期接近 250 mA，需按功耗与温升做热降额。
- 脉冲 Ifsm 可承受短时大电流，但需避免重复高能量冲击。
- 在高 Vr 条件下注意反向漏电随温度升高而增加，关键设计需留裕量。
- 焊接时遵循厂商回流温度曲线，避免超温影响器件可靠性。
七、典型电路参考
- 信号整流：用于中低功率整流与采样路径。
- 保护钳位：并联在敏感节点实现电压钳位与反向保护。
- 开关二极管：在高频开关中用作快速恢复路径，减少反向恢复引发的过冲。
八、选型与替代建议
在替代与互换时建议严格对照 Vf、Vr、Trr、If 和热耗散等关键参数。可参考常见小信号快速二极管（如 1N4148 系列）作为功能参考，但具体参数存在差异，应以实际数据手册为准。
如需完整电气特性曲线、封装外形尺寸和回流焊工艺建议，可提供厂商规格书全文以便深入评估与设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
