WMSIC Electronic Components

TOREX XC6204B502MR-G LDO Regulator XC6204B502MR

ModelXC6204B502MR-G
PackageSOT-25-5
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOREX XC6204B502MR-G
Type
TOREX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
200mV@(100mA)
Electronic Component
TOREX
Electronic Component
30uVrms
Electronic Component
XC6204B502MR-G
Electronic Component
1
Package
SOT-25-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.043g
Electronic Component
1
Electronic Component
BM0230030119
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
10V
Output
Electronic Component
Output Voltage
5V
Output Current
150mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6204B502MR-G 产品概述

一、产品简介

XC6204B502MR-G 为 TOREX(特瑞仕)系列的一款固定输出线性稳压器(LDO),单通道、正输出,输出电压为 5.0V,最大输出电流 150mA。器件具有低压差、低噪声、低静态电流和良好的电源纹波抑制特性,适合对噪声和电源抑制有较高要求的小型便携与工业终端设备。

二、主要特性

  • 固定输出:5.0V(正极输出)
  • 输出电流:最大 150mA
  • 低压差:典型 200mV @ 100mA(在更高电流下压差可能增加)
  • 静态电流(Iq):典型 70µA,适合电池供电与低功耗应用
  • 噪声:30µVrms(典型值)
  • PSRR:70dB @ 10kHz,优异的纹波抑制能力
  • 保护功能:内部过流保护与短路保护
  • 控制:带使能(EN)引脚,便于系统电源管理与节电控制
  • 工作温度:-40℃ 至 +85℃(Ta)
  • 封装:SOT-25-5,体积小,适合空间受限设计

三、典型应用场景

  • 便携式设备与电池供电系统(需低Iq 和良好纹波抑制)
  • 传感器、模拟前端、电源参考、采集系统等对噪声敏感的子系统
  • 工业控制模块、通信终端与 IoT 终端的局部稳压电源
  • MCU、外围芯片或数字逻辑电路的 5V 供电源

四、布局与外设建议

  • 输入端:建议在 VIN 与 GND 之间靠近器件放置去耦电容,以抑制输入瞬态。
  • 输出端:为保证稳定性与瞬态响应,建议在 VOUT 与 GND 之间使用低 ESR 陶瓷电容(常见 1µF–4.7µF,具体请参照原厂数据手册对电容类型与最小容量的要求)。
  • 使能端:通过 EN 引脚可以实现软启动或硬关断;建议在控制线与噪声源间保持合适隔离,避免误触发。
  • 接地:尽量采用单点或短回路的接地方式,减小噪声耦合和热阻。

五、热管理与可靠性提示

SOT-25-5 为小型封装,器件的功耗主要来自输入与输出压差乘以输出电流。设计时应评估最大工作条件下的功耗与封装散热能力,必要时通过增大 PCB 铜箔、增加散热面或降低输入电压差来控制结温。长期在高温或高电流下工作可能导致热限幅动作或可靠性下降,应留有余量并进行实测验证。

六、设计注意事项

  • 输入电压需高于输出电压并考虑压差裕量;在大电流情况下,压差会高于典型值,务必参考器件数据手册和验证条件。
  • 输出电容的类型与 ESR 对稳压器的稳定性至关重要,请严格遵照原厂建议选择电容规格。
  • 在系统级设计中,利用 EN 控制可实现功耗管理,但要确保 EN 引脚的电平定义与驱动器件兼容。
  • 尽管器件具备过流与短路保护,仍应在设计中考虑故障情形与系统安全策略。

七、总结

XC6204B502MR-G 以其低压差、低静态电流、低噪声与高 PSRR 的组合特性,适合对电源品质有较高要求的小型应用,尤其在电池供电与噪声敏感的模拟/混合信号场合表现优异。采用 SOT-25-5 小封装,便于空间受限的 PCB 布局;在最终设计中,请结合原厂完整数据手册对输入电压范围、输出电容选择与热设计进行详细核对与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.