WMSIC Electronic Components

TOREX XC6220B331ER-G LDO Regulator XC6220B331ER

ModelXC6220B331ER-G
PackageUSP-6C
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOREX XC6220B331ER-G
Type
TOREX
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
60mV@(300mA)
Electronic Component
TOREX
Electronic Component
XC6220B331ER-G
Electronic Component
1
Package
USP-6C
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.027g
Electronic Component
1
Features
Output
Electronic Component
BM0230062549
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6220B331ER-G 产品概述

一、简介

XC6220B331ER-G 是 TOREX(特瑞仕)推出的一款高性能、低静态电流的固定输出线性稳压器,输出电压为 3.3V,最大输出电流可达 1A。器件主打快速瞬态响应和低功耗,适合对稳压精度、纹波抑制与瞬态性能有较高要求的便携与工业电子设备。工作温度范围为 -40℃ 至 +85℃(Ta),封装为 USP-6C,适合空间受限的板级应用。

二、主要特点

  • 固定输出:3.3V(正极输出)
  • 最大输出电流:1A
  • 静态电流(Iq):典型 8 µA(低待机功耗)
  • 压差(Dropout):60 mV @ 300 mA(低压差设计,有利于低压差场景)
  • 电源纹波抑制比(PSRR):50 dB @ 1 kHz(抑制输入电源噪声能力强)
  • 保护功能:过流保护(OCP)、过热保护/热关断(OTP/thermal shutdown)
  • 工作电压/最大输入电压:6 V(请按器件手册确认最高允许输入)
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 封装:USP-6C(适合小型化设计)

三、性能与应用注意事项

  • 压差随输出电流上升而增大:资料中给出 60 mV 为 300 mA 条件下典型值,在 1A 工况下压差会高于该值,系统设计时需考虑最低输入电压裕量以保证 3.3V 输出。
  • 输出电容与稳定性:为保证稳压器稳定与快速瞬态响应,建议在输出端使用低 ESR 的陶瓷电容(如 X7R 系列)并靠近器件输出引脚布局,常用容量范围可在 1 µF~4.7 µF 之间(以实际评估为准)。输入侧同样需放置适当去耦电容以降低输入纹波。
  • 干扰与布局:保持输入/输出走线最短且宽,良好地接地布局和地平面有助于提升 PSRR 与瞬态响应。敏感模拟节点应远离高电流回路。

四、热管理与保护行为

  • 功耗估算:在高负载情况下(例如 Vin = 5 V、Vout = 3.3 V、Iout = 1 A),器件功耗约为 (Vin - Vout) × Iout ≈ 1.7 W,加上极小的静态损耗,须关注封装的热阻与PCB散热能力。必要时通过加大铜箔面积或采用散热板降低结温。
  • 过流/热关断:内置过流保护在短路或过载时限制输出电流,过热保护在结温超过设定阈值时采取关断措施以保护器件,待温度回落后自动恢复。设计时应避免长期在触发保护阈值附近工作以保证可靠性。

五、典型应用场景

  • MCU/FPGA/数字核心电源;
  • 通讯模块(Wi‑Fi、蓝牙、LTE 等)供电;
  • 便携式与电池供电设备;
  • 传感器前端与低噪声模拟电源;
  • 工业控制与消费类电子。

六、封装与型号选型提示

XC6220B331ER-G(TOREX,USP-6C 封装)为表面贴装器件,适合要求体积小、性能稳健的场合。选型时请参考官方规格书获取完整的电气特性曲线、引脚定义、热阻值及建议的外部元件值;样机评估时建议在最差工况(最高输入电压、最大输出电流、最高环境温度)下验证温升与保护动作。

简要布局建议:输入/输出电容靠近引脚放置,短且宽的电源回流路径,地平面充足且连结可靠,可显著提升稳定性与热散性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.