WMSIC Electronic Components

TOREX XC6902N251MR-G LDO Regulator XC6902N251MR

ModelXC6902N251MR-G
PackageSOT-23
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOREX XC6902N251MR-G
Type
TOREX
Unit
Electronic Component
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
174mV@(20mA)
Electronic Component
TOREX
Electronic Component
XC6902N251MR-G
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.073g
Electronic Component
1
Features
Built-in
Electronic Component
BM0263518914
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
16V
Output
Electronic Component
Output Voltage
2.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC6902N251MR-G 产品概述

一、产品简介

XC6902N251MR-G 是 TOREX(特瑞仕)推出的一款固定输出线性稳压器(LDO),面向对噪声、纹波抑制和低压差有要求的小型电源设计。器件输出电压固定为 2.5V,单通道输出,封装为常见的 SOT-23,适合空间受限的便携和嵌入式系统。

二、主要电气参数

  • 输出类型:固定输出
  • 工作电压(最大):16V(输入端允许的最高电源电压,请在使用前确认系统最高电压)
  • 输出电压:2.5V(固定)
  • 输出电流:最大 200mA(请在接近最大电流时注意功耗与热管理)
  • 压差(典型):174mV @ 20mA(实际压差随输出电流增加而上升)
  • 电源纹波抑制比(PSRR):45dB @ 1kHz
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 输出极性:负极(规格书中标注为负极,请在系统设计中确认参考极性)

三、封装与引脚

该器件采用 SOT-23 小型封装,适合自动化贴装与紧凑电路板布局。SOT-23 封装兼顾散热与占板面积,常见的三引脚布局便于与输入、输出和地进行连接。具体引脚功能和排列请参照厂商原始数据手册以确保接线正确。

四、主要特性与保护功能

  • 过流保护(OCP):在负载短路或过载情况下自动限制输出电流,保护器件与负载。
  • 过热保护(热关断):当芯片结温超出安全范围时自动关闭输出,避免因过热导致损坏。
  • 优良的纹波抑制性能:45dB @ 1kHz 对于抑制来自开关电源或输入噪声的干扰有明显效果。
    这些保护与性能特性使 XC6902N251MR-G 在可靠性要求较高的便携及工业应用中具有优势。

五、典型应用场景

  • 便携式设备的数字/模拟供电(MCU、传感器前端等)
  • 通信设备与接口电源降压
  • 工业控制与监测模块的局部稳压
  • 任意需要小体积、低噪声、低压差稳压的场合

六、设计与使用建议

  • 输出电容:建议在输出侧使用低 ESR 陶瓷电容以保证稳压器稳定性与瞬态响应(常见选择范围 1µF~10µF,具体容量与 ESR 请参考厂商推荐)。
  • 输入电容:靠近芯片输入端放置适当的去耦电容,以抑制输入侧瞬态与寄生感应。
  • 散热考虑:在接近最大输出电流或较大压差(Vin - Vout)条件下,应计算功耗 Pd = (Vin - Vout) × Iout,并通过合理的 PCB 铜箔面积或散热片降低结温,避免触发过热保护影响可靠性。
  • 验证压差:标注的 174mV 压差是在 20mA 条件下测得,随电流增加压差会上升,设计时应留出足够的输入余量以保证在 200mA 工作点仍满足输出要求。
  • 极性确认:规格中标有“输出极性:负极”,若系统需生成负电压或以负极参考,请务必在电路连接与原理图中核实地线与参考极性,或选择专用负电压 LDO。

七、总结

XC6902N251MR-G 是一款体积小、性能稳定的固定 2.5V LDO,具备200mA 输出能力、良好的 PSRR 与基本的过流/过热保护,适合便携设备与嵌入式电源管理。设计时需关注输入电压余量、功耗与散热,并参考厂商数据手册中的典型应用与滤波电容建议,以确保长期稳定可靠运行。若有特定应用的详细参数或电路示例需求,建议参阅 TOREX 官方资料或联系代理商获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.