WMSIC Electronic Components

TOREX XBS104V14R-G Schottky Diode XBS104V14R

ModelXBS104V14R-G
PackageSOD-123
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOREX XBS104V14R-G
Type
TOREX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOREX
Electronic Component
XBS104V14R-G
Electronic Component
1
Package
SOD-123
Electronic Component
Schottky Diode
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0257666020
Current
1A
Diode
1
Current(Ir)
2mA@40V
(Vf)
410mV@1A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XBS104V14R-G — TOREX (特瑞仕) 40V / 1A SOD-123 肖特基二极管产品概述

一、产品简介

XBS104V14R-G 是 TOREX(特瑞仕)推出的一款表面贴装肖特基整流二极管,封装为 SOD-123。该器件为单个独立二极管,面向空间受限的电源及开关应用,提供低正向压降和较好的浪涌承受能力,适用于各种中小功率整流、保护与续流场合。

二、主要电气参数

  • 二极管类型:肖特基整流,单个独立式
  • 最大直流整流电流(IF):1 A
  • 正向压降(Vf):0.41 V @ 1 A
  • 直流反向耐压(VR):40 V
  • 反向漏电流(IR):2 mA @ 40 V
  • 非重复峰值浪涌电流(Ifsm):20 A(短脉冲)
    这些参数表明 XBS104V14R-G 在 1A 工作点上具有很低的正向压降,有利于降低整流损耗;同时在短时冲击下有足够的浪涌承受能力。需要注意其在高反向电压下的漏电流相对较高,选型时应考虑工作电压与温度的影响。

三、封装与机械特性

  • 封装形式:SOD-123(表面贴装)
    SOD-123 封装占板面积小,适合自动贴装与回流焊加工。封装有助于散热到 PCB,适用于紧凑型电源模块与便携设备。选用时请参考厂商提供的焊盘推荐尺寸及回流曲线,以保证可靠焊接和热性能。

四、典型应用场景

  • 开关电源(DC-DC)整流、续流二极管
  • 电池充电器、移动设备电源管理
  • 极性保护、倒灌保护与反向电压保护
  • 输出整流、瞬态电流钳位与钳位保护
    由于 Vf 低,XBS104V14R-G 特别适合需要降低功耗与发热的场合;在需要承受短时大浪涌(例如开机浪涌或电感反向冲击)的应用中,也能提供一定保护能力。

五、设计与使用建议

  • 漏电流考虑:IR 为 2 mA@40 V,较高的反向漏电在高阻输入或休眠电路中会影响待机电流,应根据系统工作电压/温度评估实际漏电影响,必要时选用低漏电的替代型号。
  • 热管理:尽管 SOD-123 有助散热,但在连续 1 A 工作时需考虑 PCB 散热、铜箔面积与过孔布置来降低结温。建议在板上为二极管旁留足铜箔并考虑热过孔。
  • 浪涌能力:Ifsm=20 A 适合短脉冲浪涌(例如 8.3 ms 半正弦),但不适合长时间过流,需配合熔断或限流设计保护。
  • 焊接与可靠性:遵循 TOREX 的回流焊曲线及焊盘设计,避免超过推荐温度与时长,以保证封装与电气性能稳定。
  • 验证测试:在最终设计中进行温升与漏电随温度变化的验证,尤其是在高温或高工作电压条件下。

六、优势总结

XBS104V14R-G 结合了肖特基二极管的低正向压降与 SOD-123 的小型化封装,适用于对效率和版面空间有要求的中小功率应用。其短时 20 A 浪涌能力和 40 V 反向耐压,使其在多种电源保护与整流场合具有良好适应性。选型时需关注反向漏电与热设计,确保在目标应用下满足性能与可靠性要求。

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