WMSIC Electronic Components

TOREX XCL102D503CR-G Converter XCL102D503CR

ModelXCL102D503CR-G
Package6-TDFN
BrandTOREX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOREX XCL102D503CR-G
Type
TOREX
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOREX
Electronic Component
XCL102D503CR-G
Electronic Component
1
Package
6-TDFN
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.068g
Electronic Component
1
Features
Output; Load
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265104508
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
650mV~6V
Switching Frequency
3MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XCL102D503CR-G 产品概述

一 概要说明

XCL102D503CR-G 是 TOREX(特瑞仕)推出的一款高频升压型 DC-DC 恒定输出电压转换器,针对空间受限和对快速瞬态响应有要求的便携式和电池供电系统设计。器件内置开关管并采用同步整流结构,能够在输入电压 0.65V 至 6V 范围内稳压输出固定 5.0V,最大输出电流可达 450mA(约 2.5W 输出功率),开关频率高达 3MHz,从而显著减小外部电感和外围元件体积。

二 主要规格要点

  • 功能类型:升压型 DC-DC 转换器(固定输出 5.0V)
  • 输入电压范围:0.65V ~ 6.0V
  • 输出电压:4.9V ~ 5.1V(典型 5.0V)
  • 最大输出电流:450mA(约 2.5W)
  • 开关频率:3MHz(高频,有利于小尺寸外设)
  • 拓扑结构:升压式,内部开关管
  • 同步整流:支持(提升效率,无须外部肖特基二极管)
  • 输出通道数:1 路
  • 保护功能:过流保护(OCP)、输出放电、负载断开、保护锁死(保护锁定)
  • 工作温度范围:-40℃ ~ +85℃(TA)
  • 封装:6-pin TDFN(带裸露焊盘,利于热量散逸)

三 特性与优势

  • 高集成度:内部集成开关管与同步整流,外围元件需求少,系统尺寸更小、布局更简洁。
  • 高频工作:3MHz 开关频率允许使用尺寸更小的电感与电容,适合空间受限的便携设备。
  • 守护电源完整性:内建过流保护、输出放电与负载断开功能,在异常或关断时迅速放电输出,避免残留电压影响系统。
  • 宽输入范围:支持从亚 1V 的电池(如单节低电压锂电/干电池)升压到稳定 5V,适配多种电源场景。
  • 散热可靠:6-TDFN 裸露焊盘便于将热量传导到 PCB,大幅提升功率处理能力与热稳定性。

四 典型应用场景

  • 便携式充电器或 USB 供电模块(为 MCU、传感器或外设提供 5V)
  • 电池供电设备(单节或多节低压电池升压到 5V)
  • 可穿戴与手持终端、IoT 节点与传感器网关
  • 小型电源模块、便携式音频或照明驱动

五 设计与布局建议

  • 电感选择:建议使用低 DCR、具有足够饱和电流余量的功率电感。由于 3MHz 高频,典型电感值可在 0.47 µH 至 2.2 µH 范围内选择,实际值需根据输入电压、输出电流和效率权衡后确认。
  • 输出电容与输入电容:优先选用 X5R/X7R 陶瓷电容以保证低 ESR 与高频特性。输入端常见配置为 4.7 µF 至 22 µF,输出端根据纹波及瞬态要求推荐 22 µF 至 100 µF 并联若干陶瓷以改善瞬态响应。
  • PCB 布局注意:
    • 将裸露焊盘完整焊接至接地平面以优化散热与回流路径。
    • 开关节点(LX)走线尽可能短且远离敏感模拟信号,减少 EMI。
    • 输入电容靠近 VIN 与 GND 引脚布置,输出电容靠近 VOUT 与 GND 引脚放置,提高稳定性与抑制振铃。
  • 热设计:在高输出功率(接近 2.5W)下需关注器件结温,必要时加大 PCB 铜箔面积或使用多层接地平面散热。

六 保护行为说明

  • 过流保护(OCP):当负载电流超过设定阈值时,芯片会进入保护机制以防止器件或外部元件损坏,保护触发后可能限制输出电流或进入保护锁死态。
  • 输出放电:在关断或故障条件下,内部放电脚可将输出快速放回低电平,避免外部电路处于危险电压。
  • 负载断开与保护锁死:在异常持续存在时,器件可锁定保护状态,需要复位或断电重新上电以恢复工作,设计中应考虑外部复位或重试策略。

七 选型与注意事项

  • 请核对工作环境温度与功率需求,确保在最高环境温度下器件不会过热或触发热关断。
  • 由于工作频率较高,外围元件(引线电感、电容封装、走线)对性能影响更大,建议在原型阶段进行功耗与热评估,并在 PCB 版上做好 EMI 测试。
  • 若对效率、纹波或瞬态有更高要求,可根据具体工况调整电感与输出电容组合,或在必要时采用热增强措施。

XCL102D503CR-G 以其高频、小封装与丰富保护功能,非常适合小型电源模块与便携设备中的 5V 升压应用。对系统设计者而言,合理的元件选型与 PCB 布局是获得最佳效率与稳定性的关键。

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