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TE Connectivity 5177986-6
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TE Connectivity 5177986-6
- Type
- TE CONNECTIVITY
- Unit
- Electronic Component
- Minimum package
- 650 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 5177986-6
- Electronic Component
- 1
- Electronic Component
- 2
- Electronic Component
- Electronic Component
- Electronic Component
- and Connector
- Electronic Component
- 0g
- Electronic Component
- 0.031"（0.80mm）
- Electronic Component
- 1
- Electronic Component
- 140
- Electronic Component
- BM0264249935
- Type
- Surface Mount
- Electronic Component
- 0.191"（4.85mm）
- Connector Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TE Connectivity 5177986-6 产品概述
一、产品简介
5177986-6 是 TE Connectivity（美国泰科）推出的一款高密度插头连接器，型号描述为 CONN PLUG 140POS SMD GOLD。该件为双排 140 针（2×70）、0.031"（0.80 mm）间距的表面贴装插头，适用于板对板或板对模块的高密度互连需求。中央触点带式设计配合板导轨，提高插入对准和机械稳定性。
二、主要规格要点
- 触点数：140 POS（双排布局）
- 间距：0.031"（0.80 mm）
- 排数：2 排
- 安装类型：表面贴装（SMD）
- 触头表面处理：镀金，厚度 8.00 µin（0.203 µm）
- 特性：板导轨（板上对准与导向）
- 接合堆叠高度可选：5 mm、9 mm、13 mm、17 mm
- 板上高度（板面至插头基准）：0.191"（4.85 mm）
三、性能与设计特点
- 高密度：0.80 mm 间距在有限 PCB 面积内实现更多信号通道，适合机箱内紧凑布局。
- 金属表面处理：金覆盖保证低接触电阻与良好导通性能，有助于信号完整性和耐腐蚀性。8.00 µin 的金厚度适合需要可靠接触但对插拔循环要求为中等的场景。
- 机械定位：板导轨与中央触点带设计有利于连接器与对接件的准确定位和插入力分布，降低接触损伤风险。
- 多种堆叠高度：提供 5/9/13/17 mm 可选，便于在不同系统架构中实现板对板距离控制（如高速接口、散热与机械间隙要求）。
四、典型应用场景
- 网络与通信设备（路由器、交换机板间互连）
- 服务器与存储系统的背板或模块连接
- 工业控制和嵌入式系统的高密度接口
- 测试与测量平台的模块化连接方案
五、制造与装配建议
- 推荐使用与制造商数据手册一致的 PCB 焊盘和阻焊开窗设计，确保回流焊可重复性和焊点可靠性。
- 由于为 SMD 类型，建议采用回流焊工艺并按厂方 JEDEC/IPC 建议的温度曲线进行焊接。避免波峰焊。
- 设计 PCB 时预留板导轨配合区和必要的机械固定点，以提高插拔寿命和抗震动能力。
- 在采购与选型阶段，确认所需堆叠高度（5/9/13/17 mm）与系统空间匹配，并参考 TE 提供的 3D 模型与装配公差。
六、选型与后续工作
在最终选型前，请参考 TE Connectivity 的完整产品资料和数据手册，核对机械尺寸、插拔力、额定电流/电压、耐久性（插拔循环次数）等详尽参数；如有高速信号需求，还需查看信号完整性评估与阻抗控制建议。若需替代或配套的对接件（receptacle/mezzanine），建议与制造商或经销商确认兼容型号。
总结：5177986-6 提供高密度、可选堆叠高度和板导轨定位的 SMD 插头方案，适合对空间、对准与可靠接触有较高要求的板对板互连应用。在设计与制造中遵循 TE 的推荐布局与焊接规范，可获得稳定的电气与机械性能。
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