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TE Connectivity 2318579-1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TE Connectivity 2318579-1
- Type
- TE CONNECTIVITY
- Unit
- Electronic Component
- Minimum package
- 300 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 2318579-1
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- Electronic Component
- Electronic Component
- Solder
- Electronic Component
- Connector
- Electronic Component
- 1g
- Electronic Component
- TE Connectivity AMP Connectors
- Electronic Component
- 1
- Electronic Component
- 76
- Electronic Component
- BM0230596462
- Type
- Surface Mount
- Electronic Component
- Digi-Key Discontinued
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2318579-1 产品概述
一、产品简介
2318579-1 为 TE Connectivity（AMP Connectors）出品的 QSFP‑DD（双密度）受座型高速插座，76 针设计，面向高带宽光电模块连接应用。该件为直角表面贴装（R/A SMT）、焊接端接、卷带（TR）包装。Digi‑Key 显示该零件已停产，采购需留意库存或替代件。
二、关键特性
- 连接器类型：QSFP‑DD（双密度）受座，76 针位。
- 安装/端接：直角表面贴装（SMT），焊接端接适配常规回流工艺。
- 触头与耐用性：触头表面镀金，厚度 30.0 µin（0.76 µm），提升接触可靠性与耐腐蚀性。
- 机械特征：板导轨设计有助于定位与机械支撑，提高插拔定位精度与耐久性。
- 包装与状态：卷带（TR）包装，Digi‑Key 状态为停产（请向 TE 或授权分销商确认现货与替代方案）。
三、典型应用
该受座适用于高密度光模块与背板连接场景，常见于：
- 数据中心交换机与路由器的端口模块；
- 高速网络接口卡（NIC）、聚合设备与光纤收发器；
- 电信与企业级光互连系统要求 QSFP‑DD 标准的场合。
四、PCB 设计与装配建议
- 高频性能：QSFP‑DD 通道属高速差分信号，应按 QSFP‑DD MSA 建议设计差分对，控制差分阻抗（典型 100 Ω）并严格匹配长度。
- 走线与过孔：尽量减少 stubs，必要时采用反钻（back‑drilling）消除回弹；对高速回流路径做好阻抗连续性处理。
- 焊接工艺：按 TE 提供的回流曲线与焊盘建议布局制作锡膏模板，确保焊点完整；注意板导轨位置的机械支撑与焊点强度。
- 机械固定：若板上有导轨或支撑柱，留意对应焊盘/过孔，以保证插拔力不通过 SMT 焊点承受全部力矩。
五、可靠性与维护
- 接触寿命：镀金触头提供良好接触特性，但具体插拔寿命请参照 TE 数据手册。
- ESD 管理：高速模块与插座对静电敏感，装配与维护时应实施 ESD 防护措施。
- 存储与处理：卷带包装便于 SMT 贴装，存放时避免潮湿与机械碰撞；若需返修，按厂家流程操作以免损伤触头或镀层。
六、采购与替代建议
- 停产提示：2318579-1 在 Digi‑Key 标注停产，建议联系 TE 客服或授权分销商确认库存与替代型号。
- 替代方向：可在 TE 系列中查找等效 QSFP‑DD 受座或向其他主流连接器厂（如 Amphenol、Molex、Samtec 等）查询兼容受座，但需比对机械尺寸、针脚映射与信号完整性参数。
备注：本文为基于产品关键参数的概述，应用设计与可靠性验证请参照 TE 官方产品规格书与 QSFP‑DD MSA 文档，或与 TE 工程支持联系以获取详细机械图与电气规范。
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