WMSIC Electronic Components

TE Connectivity 2337019-1

Model2337019-1
PackageSMD
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 2337019-1
Type
TE CONNECTIVITY
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
2337019-1
Electronic Component
1
Package
SMD
Electronic Component
RFCoaxial Connector
Electronic Component
0.033g
Electronic Component
50Ω
Frequency
6GHz
Electronic Component
1
Electronic Component
BM0042835292
RF
IPEX
Operating Temperature
40℃~+85℃
Interface
2mm
Interface Type
Electronic Component
Electronic Component
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:TE Connectivity 2337019-1(UMCC MICRO-COAX RECEPTACLE GEN 1)

TE Connectivity(美国泰科)作为全球领先的电子连接器制造商,推出的2337019-1型号连接器属于其UMCC(U.FL)系列,具体为Micro-Coax Receptacle Gen 1。这款连接器以其出色的性能和广泛的应用范围,成为了现代电子设计中的重要组件。本产品擅长在严苛环境下完成高频信号的连接,并提供可靠的电气性能。

基本参数

  1. 型号: 2337019-1
  2. 制造商: TE Connectivity AMP Connectors
  3. 连接器样式: U.FL(UMCC)
  4. 类型: 插座,公插针
  5. 端口数: 1
  6. 阻抗: 50 欧姆
  7. 频率响应: 它的频率最大值可达6GHz,适用于多种高频应用。
  8. 安装类型: 表面贴装型,方便在电路板上的集成。
  9. 包装形式: 卷带(TR),适合批量生产和自动化组装。
  10. 工作温度范围: -40°C 至 85°C,适合多种工业和消费电子产品的应用。

物理特性

2337019-1连接器的基体材料为铜合金,使其具备良好的导电性能和耐腐蚀性。中心触头镀层采用镀金工艺,提高了可靠性,减少了信号衰减,尤其是在高频应用中,镀金触头可以有效防止接触不良。同时,介电材料为热塑塑胶,确保了产品在各种环境下的稳定性和耐用性。

连接方式

该连接器的触头端接和保护端接均为焊接设计。这种设计不仅确保了良好的电气连接,还增强了机械强度,适用于表面贴装的PCB设计。无论是在高温焊接环境下,还是在强震动条件下,焊接方式的稳定性都为其在各种复杂应用提供了保障。

应用场景

2337019-1连接器广泛应用于包括但不限于以下领域:

  1. 通信设备:由于其高频特性,该产品非常适合于无线通信设备,如移动电话基站、Wi-Fi模块等。
  2. 消费电子:在智能手机、平板电脑及其他便携设备中,高密度、小体积的特点使其成为连接高频信号的理想选择。
  3. 工业设备:许多需要快速数据传输和高可靠性的仪器设备中,也会使用此种连接器,例如传感器、自动化设备等。
  4. 医疗设备:医疗仪器中的信号输出和输入对于连接器的性能要求极高,而2337019-1提供的优良电性能正好满足这些需求。

总结

TE Connectivity 2337019-1作为UMCC MICRO-COAX RECEPTACLE系列的一部分,不仅在技术规格上满足现代电子产品高频、高性能的需要,还在安装和应用灵活性方面表现出色。其优异的焊接设计、材料选择和耐热性能,使得其在多种高要求应用中成为不二之选。无论是在设计新产品,还是在优化现有设备时,选择2337019-1连接器无疑将为您的项目提供出色的支持和保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.