WMSIC Electronic Components

TE Connectivity 1658621-1

Model1658621-1
PackageP=2.54mm
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 1658621-1
Type
TE CONNECTIVITY
Minimum package
144 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
1658621-1
Electronic Component
1
Package
P=2.54mm
Electronic Component
2
Electronic Component
IDCInsulation Displacement Connector(Box Header / Box Header)
Electronic Component
2x5P
Electronic Component
2.54mm
Electronic Component
2.4g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0258669618
Electronic Component
Electronic Component
Operating Temperature
65℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1658621-1 产品概述

一、产品概况

1658621-1 为 TE Connectivity(美国泰科)系列的 Ribbon Cable 连接器,属于 Wire-to-Board 类型的低矮型 receptacle。该产品为 2 排 × 5 位(共 10 位),排距 2.54 mm(0.1 in),垂直安装、贯通孔(Through Hole)焊接固定。结构为二件式(连接器 + 压排),适用于扁平排线与印制电路板之间的可靠信号连接。颜色为黑色,适用工作温度范围 -65℃ 至 +105℃。

二、主要技术参数

  • 连接器类型:简牛座(Ribbon Cable Receptacle)
  • 芯数:10 位(2×5)
  • 排距 / 芯距:2.54 mm(0.1 in)
  • 结构:垂直、贯通孔(Through Hole)焊接
  • 额定电流:1 A/针
  • 额定电压:250 V
  • 触头材质:磷青铜
  • 触头镀层:金
  • 安装方式:二件式(连接器 + 压排)
  • 工作温度:-65℃ ~ +105℃
  • 外观颜色:黑色

三、产品特性与优势

  • 尺寸标准化:2.54 mm 芯距为行业常用规格,便于与标准 PCB 布局和排线配合。
  • 接触可靠:磷青铜触点结合金属镀金处理,提供良好的导电性与耐蚀性,适合多次插拔及低电流信号传输场景。
  • 温度适应性强:-65℃~+105℃ 的工作范围能满足大多数工业与电子设备内部环境要求。
  • 模块化装配:二件式设计便于在生产线上分段装配或现场快速更换压排/连接器件,提高维护效率。
  • 低矮设计:Low profile 结构适用于空间受限的机箱或板间连接场合。

四、典型应用场景

  • 内部排线连接:计算机、通讯设备、消费电子内部扁平排线到 PCB 的信号连接。
  • 工业控制:低电流信号或控制线束的连接、模块间互联。
  • 测试与夹具:测试平台或功能验证夹具中的可重复插拔连接。
  • 小型仪器设备:空间受限场合的低压低电流信号传输。

五、使用与装配建议

  • PCB 布局:按 2.54 mm 芯距精确布线,留足贯通孔和焊盘长度,确保焊接强度与机械支撑。
  • 焊接工艺:采用标准贯通孔焊接工艺,注意控制焊接温度与时间,避免对塑料件或镀层造成损伤。具体焊接参数建议参阅厂家数据手册。
  • 压排与排线:装配时确保压排与排线对准,施力均匀,避免弯折或应力集中影响接触可靠性。必要时增加应力释放结构或扎带固定。
  • 环境与清洁:金镀层对氧化耐受性好,但在恶劣腐蚀性环境或潮湿场所仍建议采取密封或防护措施;清洗时使用与金属兼容的清洗剂,避免长时间浸泡。
  • 额定值注意:单针额定电流为 1 A,长期工作时请考虑电流降额与散热条件,避免超负荷使用。

六、选型与采购提示

在采购或替代选型时,建议确认以下要点:

  • 与目标排线或对接端子的兼容性(尺寸、对位方式、压排类型)。
  • PCB 孔径与焊盘样式是否与本件匹配。
  • 是否需要阻燃等级、RoHS 或其他认证;若有特殊环境(高湿、高振动),请向厂商确认适用性与加固方案。
  • 参考 TE Connectivity 官方数据手册和 3D/2D 尺寸图,确保机械和电气参数满足系统要求。

如需进一步的机械图纸、推荐的 PCB 封装(footprint)和焊接工艺参数,请查阅 TE Connectivity 官方资料或联系经销商获取原厂技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.