WMSIC Electronic Components

TE Connectivity 2041262-1

Model2041262-1
PackageSMD,P=0.8mm
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TE Connectivity 2041262-1
Type
TE CONNECTIVITY
Unit
Electronic Component
Minimum package
450 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
2041262-1
Electronic Component
1
Package
SMD,P=0.8mm
Electronic Component
2
Electronic Component
Electronic Component
Electronic Component
Solder
Electronic Component
Connector
Electronic Component
Electronic Component
Electronic Component
2.72g
Electronic Component
0.031""(0.80mm)
Electronic Component
Electronic Component
Electronic Component
TE Connectivity AMP Connectors

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TE Connectivity 2041262-1(CONN PCI EXP MINI FEMALE)产品概述

2041262-1 是 TE Connectivity(美国泰科)推出的一款面向 Mini PCI Express(Mini PCIe)卡的母座连接器,适用于嵌入式、通信和移动平台中对紧凑、高可靠性插拔接口的需求。该连接器为右角表面贴装(SMD)结构,配置为 52 针、双排、0.80 mm 间距,带板导轨(board rails)以提高插入定位和机械支撑,适配标准 Mini PCIe 迷你卡厚度 1.00 mm。

一、主要规格概览

  • 制造商:TE Connectivity (AMP Connectors)
  • 型号 / 基本编号:2041262-1(基本产品编号 2041262)
  • 封装与交付:卷带(TR),件号处于有源状态
  • 卡类型:PCI Express 迷你型卡(Mini PCIe)
  • 极性/性别:母头(Female)
  • 引脚数:52 针(双排,排数:2)
  • 间距:0.031"(0.80 mm)
  • 卡厚度:0.039"(1.00 mm)——符合 Mini PCIe 卡规范
  • 安装类型:表面贴装(SMD),直角(Right-angle)安装方式
  • 端接方式:焊接(Solder termination)
  • 触头材料:磷青铜(Phosphor bronze)
  • 触头表面处理:镀金(闪镀/flash gold)以保证接触可靠性
  • 绝缘体材料:玻纤增强液晶聚合物(Glass‑filled LCP),颜色:黑色
  • 特性:板导轨(用于卡对位、机械支撑)

二、机械与材料特性

该连接器采用玻纤增强液晶聚合物(LCP)作为绝缘体,具备良好的耐热性、尺寸稳定性与耐潮性,适合标准的无铅回流贴装工艺。触点采用磷青铜基材并做金属化处理,表面为镀金处理(闪镀),可提供低接触电阻与良好抗氧化性能,利于长期稳定的电接触。

右角表面贴装的结构使连接器易于在 PCB 边缘或面上布局,板导轨设计则用于引导 Mini PCIe 卡插入并提供侧向支撑,减轻单靠焊点承受的机械应力,从而提高插拔寿命与抗振动能力。

三、电气与可靠性考量(使用建议)

  • 引脚间距 0.80 mm,52 针双列布局,兼容标准 Mini PCIe 接口的信号与电源分配。
  • 触点采用镀金以保证信号端的接触可靠性,但具体的电流/电压与插拔寿命参数请参照 TE 官方规格书或样品数据。
  • 推荐配合符合 Mini PCIe 规范的卡件使用,并在 PCB 设计时保留导轨与连接器周围的机械固定区域以便安装螺柱或支撑件。
  • 适配主流无铅回流工艺;在回流及清洗流程设计上应避免对金属接触面造成污染,尽可能遵循制造商的焊接和清洗建议。

四、PCB 布局与装配建议

  • 根据 0.80 mm 间距与右角 SMD 封装,合理设计焊盘尺寸以保证良好的焊接档位与焊点可靠性;推荐依据 TE 提供的推荐焊盘和过孔图进行设计。
  • 为保证插入对位与机械强度,PCB 上应保留连接器侧边的板导轨安装空间,并考虑在导轨附近设置机械固定螺孔或支撑柱以承受卡插拔产生的力。
  • 装配时建议使用自动贴装与回流焊流程,卷带(TR)包装利于高速贴装生产线。贴装前注意 ESD 防护与保护触点免受污染。

五、典型应用场景

  • 笔记本和平板计算设备的 Mini PCIe 扩展模块插槽
  • 嵌入式系统、工业电脑、网络路由器与无线通信设备中 Wi‑Fi / LTE 模块的连接
  • 工业与商业设备中需要可替换、小型化扩展卡的场合(例如 mSATA/mini‑PCIe 模块)
  • 测试与开发平台中用于模块快速插拔与替换

六、采购与包装信息

  • 该型号以卷带(TR)形式包装,适合自动贴片线使用;库存与交期请向 TE 授权分销商查询。
  • 在选型与采购前,建议下载并审阅 TE 官方的产品规格书(Datasheet)与推荐 PCB 布局图,以获取完整的机械图、焊接参数与环境/可靠性数据,必要时索取样品进行工程验证。

总结:2041262-1 为一款面向 Mini PCIe 卡的 52 针双排右角表面贴装母座,具备板导轨设计、金属镀金触点与玻纤增强 LCP 绝缘体,适合在空间受限且需可靠插拔的嵌入式与通信应用中使用。选型时请结合具体的电气负载、插拔寿命与 PCB 机械结构进行验证,以确保长期可靠运行。

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