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TE Connectivity 2201778-1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TE Connectivity 2201778-1
- Type
- TE CONNECTIVITY
- Minimum package
- 1000
Technical parameters
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 2201778-1
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SD / Connector
- Electronic Component
- 0.03g
- Type
- Micro SD
- Electronic Component
- 1
- Electronic Component
- BM0257275017
- Electronic Component
- Electronic Component
- Connector Type
- Card Socket
- Electronic Component
- 1000
- Electronic Component
- 1.65mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TE Connectivity 2201778-1 产品概述
一、产品简介
TE Connectivity 型号 2201778-1 为 MicroSD（TF）卡自弹式卡座，右角安装，8 接点设计，中心距 1.1 mm（0.04 in），本体最大高度 1.65 mm。该连接器适配标准 Micro Secure Digital 卡，通过自弹（push-push）结构实现卡片的便捷插拔与固定，广泛用于体积受限的电子设备中。
二、主要特性
- 卡连接方式：自弹式（插入弹出机制），操作直观可靠；
- 卡类型：MicroSD / TF 卡兼容；
- 引脚数：8 位接点，满足标准 SD 接口信号需求；
- 安装形式：右角（Right Angle）贴装，便于在边缘或侧面布置卡槽；
- 机械尺寸：本体最大高度 1.65 mm，中心线间距 1.1 mm；
- 温度范围：-30 ～ 85 ℃（-22 ～ 185 ℉），适应大多数消费类与工业环境。
三、技术参数（关键）
- 接触位数：8；
- 中心距：1.1 mm；
- 安装方向：右角；
- 机构：自弹式卡位；
- 最大高度：1.65 mm；
- 工作温度：-30 ～ 85 ℃。
注：具体电气额定值、接触电阻与耐久循环次数请参照 TE 官方规格书以获取精确参数。
四、典型应用
- 智能手机、平板类便携终端（需体积小、插拔便捷）；
- 车载信息娱乐系统（在温度允许范围内使用）；
- 工业控制器与数据记录器；
- 消费电子（相机、便携设备）、物联网终端等需外扩存储的场景。
五、安装与使用建议
- PCB 设计时按 TE 提供的封装与焊盘图优化焊盘形状与阻焊，确保机械强度与焊接可靠性；
- 采用与 PCB 材料相配合的回流工艺，遵循器件制造商的温度曲线以避免变形；
- 考虑外壳开口尺寸与插拔空间，保证自弹机构不受阻碍；
- 对有高频或 EMI 要求的系统，建议在卡座附近布局适当屏蔽和滤波元件；
- 在可能存在静电放电的环境中增加防护（接地、ESD 抑制器等）。
六、兼容性与采购提示
此型号由 TE Connectivity（美国泰科）制造，适配标准 MicroSD/TF 卡规格。采购时建议核对物料号与最新数据表，确认是否需要加强型或封装变种以满足特定环境与寿命要求。若项目对耐久性、温度等级或汽车级认证有更高要求，应向厂家咨询对应的系列或替代品。
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