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TE Connectivity 1376387-1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TE Connectivity 1376387-1
- Type
- TE CONNECTIVITY
- Unit
- Electronic Component
- Minimum package
- 100 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 1376387-1
- Electronic Component
- 1
- Package
- Through-hole, P=5mm
- Electronic Component
- 2
- Electronic Component
- Wire-to-Board
- Electronic Component
- 6.2mm
- Electronic Component
- 2.18g
- Electronic Component
- 5mm
- Electronic Component
- 1
- Electronic Component
- BM0230687157
- Electronic Component
- Through-hole
- Operating Temperature
- 40℃~+105℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1376387-1 产品概述
一、产品简介
1376387-1 为 TE Connectivity（美国泰科）出品的直插式直立针座（CONN HEADER VERT 6POS），共6 个触点位（6POS），两排布局（双排），适用于 5.00 mm 标准间距的插件连接。该产品定位为通用型板对线连接器，适合需要可靠接触与简单插拔的电子装置与控制模块。
二、主要参数与结构
- 间距（Pitch）：5.00 mm，符合常见工业控制与端子布局标准；
- 排数 / 位置：2 排、6 位（总位数 6）；
- 行距（Row spacing）：6.2 mm，双排互相错列或并排时的中心距；
- 安装方式：直插（Through-Hole），适合波峰焊或手工组装的 PCB 固定安装；
- 封装形式：插件式，竖直方向（vertical header），便于顶部连接器插入。
三、材料与表面处理
- 触头材质：铜合金，兼顾弹性与导电性；
- 触头镀层：锡（Sn）镀层，提供良好焊接性与成本优势，适用于一般室内和非苛刻环境。因锡镀层在腐蚀或高湿环境下相对金镀易氧化，需根据使用场景评估是否满足长期可靠性要求。
四、工作温度与环境适应性
额定工作温度范围为 -40 ℃ 至 +105 ℃，覆盖绝大多数商用与工业环境温度需求。该范围内材料和电性能保持稳定，但在高湿、高腐蚀或含腐蚀性气体的环境中，应考虑额外防护（如涂覆、密封或更高等级镀层）。
五、PCB 布局与安装建议
- 根据 5.00 mm 间距与 6.2 mm 行距在 PCB 上布局对应孔位；
- 采用通孔焊接工艺时，建议参考 TE 官方数据表中的孔径与涂层要求以确保焊点可靠；
- 竖直安装方式便于顶部插拔，但要求孔位机械强度与焊盘面积足够，必要时增加固定柱或支撑结构以承受插拔力与振动。
六、典型应用场景
本型号适用于工业控制板、家电主板、仪器仪表、通信设备及各种需要板对线或模块连接的场合，尤其在需要较大间距以便布线或承受较大电流/机械应力的设计中表现良好（具体电气额定需参考原厂数据表）。
七、选型与检验建议
选型时应核对完整数据表以确认电气额定（电流、电压、接触电阻等）、推荐孔径与波峰焊工艺参数。若使用环境存在潮湿、盐雾或长期插拔频繁情形，建议评估是否改用金镀触点或增加防护措施。采购与验收时注意外观镀层质量、引脚直度及焊盘适配性，必要时进行样机焊接测试与插拔寿命评估。
若需我提供该型号的 PCB 封装建议图（参考孔径与焊盘尺寸）、或比对同类替代件清单，可进一步告知使用工艺与环境要求。
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