WMSIC Electronic Components

TE Connectivity 6469002-1

Model6469002-1
PackageP=2.5mm
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 6469002-1
Type
TE CONNECTIVITY
Minimum package
180 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
6469002-1
Electronic Component
1
Package
P=2.5mm
Electronic Component
8
Electronic Component
and Connector
Electronic Component
3g
Electronic Component
2.5mm
PIN
80P
Electronic Component
1
Electronic Component
BM0229926180
Electronic Component
Electronic Component
Operating Temperature
65℃~+105℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

6469002-1 产品概述

一、主要参数

  • 型号:6469002-1(TE Connectivity,Z‑PACK 系列)
  • PIN 总数:80P(8 排 × 10 列)
  • 安装方式:弯插(右角/弯脚 PCB 安装)
  • 芯距:P = 2.5 mm
  • 额定电流:700 mA / 针
  • 额定电压:250 V
  • 触头镀层:金(接触可靠、抗氧化)
  • 工作温度:-65 ℃ ~ +105 ℃
  • 类型:High Speed Backplane Connector,PCB Mount Header,Mating Alignment(带对位导柱/导舌)

二、产品定位与简介

6469002-1 属于 TE Connectivity 的 Z‑PACK 系列高密度背板连接器,面向需要稳定、高速信号传输及可靠机械对位的板对板/背板应用。该件为 80 针弯插式 PCB 头端,采用 2.5 mm 芯距和多排布局,兼顾高密度布线与便于插拔的对位结构,适用于通信、服务器、工业控制及测量设备等场合的背板互联与模块插接。

三、关键特性

  • 高密度设计:8 排 × 10 列共 80 接点,在较小占板面积内实现更多信号通道。
  • 弯插 PCB 安装:弯曲引脚便于实现板对板的右角连接或特定走线要求,增强机械支撑性。
  • 对位导向:Mating Alignment 与导向凸舌/导柱设计保证插合时的精确对位,降低插拔损伤与接触失配风险。
  • 金镀触点:表面金属化处理提高接触可靠性和耐腐蚀性,有利于低阻抗、高重复插拔场合。
  • 宽温特性与电气规格:-65℃~+105℃ 的工作温区以及 700 mA/250 V 的额定值,满足工业级与通信级环境要求。

四、典型应用

  • 电信/数据中心背板与中继板连接
  • 服务器与存储系统板对板互联
  • 工业控制与自动化设备模块化连接
  • 高速测试平台与仪器的插拔式接口

五、设计与使用建议

  • 焊接与装配:弯插式引脚通常为通孔焊接,请按 TE 的焊接与波峰/手工焊接工艺规范执行,避免超温损伤塑料件。
  • 布线与信号完整性:用于高速信号时,建议在板设计阶段做好差分对与地平面布局,控制阻抗并减少串扰;对关键通道做仿真验证。
  • 机械支撑:大尺寸背板或多次插拔环境下,注意在 PCB 上设置加固支撑或固定槽位,避免集中机械应力。
  • 电气载流与散热:单针额定 700 mA,设计时应避免超载并考虑热积累;多个高电流接点并列时注意整体热管理。
  • 兼容性与备件:选型前核对配套插头/插座型号及寿命(插拔次数)、接触电阻与认证要求,必要时向 TE 索取详细数据表和 3D 工程图。

六、结论

6469002-1 为面向高密度背板与板对板连接的专业级弯插式 PCB Header,兼顾机械对位与电气可靠性,适合要求稳定插合、高速传输及工业温度范围的系统。最终选型与电路布局应参照 TE 官方数据手册与应用说明,必要时在样机上验证信号完整性与可靠性,以确保长期稳定运行。

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