WMSIC Electronic Components

TE Connectivity 5100147-1

Model5100147-1
PackageThrough-hole, P=2mm
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 5100147-1
Type
TE CONNECTIVITY
Minimum package
11 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
5100147-1
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
5
Electronic Component
and Connector
Electronic Component
19.65g
Electronic Component
2mm
PIN
110P
Electronic Component
1
Electronic Component
BM0230693195
Electronic Component
Electronic Component
Operating Temperature
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

5100147-1 产品概述

一、产品简介

5100147-1 为 TE Connectivity(美国泰科)Z‑PACK/A RAF 系列的矩形连接器,具有 110 针、5 排布局,面向需要高密度、可靠电气连接的电子系统。该型号触头镀金、额定电流 1.5A/触点,并能在 -55℃ 至 +125℃ 的宽温区间内稳定工作,适合工业、通信及军工等对温度和可靠性有较高要求的场合。

主要参数(概览)

  • PIN 总数:110P(5 排 × 每排 22 针)
  • 排数:5
  • 额定电流:1.5 A / 针
  • 触头镀层:金
  • 工作温度:-55℃ ~ +125℃
  • 品牌:TE Connectivity(美国泰科)
  • 描述:连接器,TE Z‑PACK/A RAF 系列

二、主要特性

  • 高密度布线:110 针配置在 5 排设计下可实现紧凑的信号/电源分配,节省 PCB 面积。
  • 镀金触头:金属触点镀金处理,提升接触可靠性、降低接触电阻并增强抗氧化性能,适合低电流或高可靠性信号传输。
  • 宽温适应性:-55℃ 到 +125℃ 的工作温度范围,满足严苛环境下长期运行要求。
  • 中等电流承载:1.5A 额定电流适用于多数信号及小功率电源回路。

三、电气与环境参数(重点关注)

  • 单针额定电流:1.5A(工作电流应考虑整体发热与散热、接线密度及使用环境)
  • 触头镀层:金,利于长期可靠接触并减少氧化带来的接触不良
  • 工作温度范围:-55℃ ~ +125℃,适合极端环境和高/低温循环场景
  • 绝缘耐压、插拔寿命、接触电阻等参数请以 TE 官方规格书为准,选型时建议参考完整数据表与环境测试结果

四、结构与材料(典型说明)

  • 触头:典型采用铜合金基材并镀金处理,以兼顾导电性与机械弹性;确切材质与镀层厚度请参照厂方资料。
  • 接口与外壳:常见为高强度工程塑料或改性材料,提供必要的机械支撑与绝缘保护。
  • 机械特性:Z‑PACK 系列通常设计用于可靠定位与插拔配合,可能包括对位导轨、锁紧或定位销等结构以保证连接稳定性(具体结构以实际产品图为准)。

五、典型应用场景

  • 通信设备:主板间、背板连接或模块化设备内部互连,适合需高密度信号分配的场合。
  • 工业控制:PLC、运动控制器、数据采集模块等需要在宽温环境中工作的系统。
  • 航空/军工设备:在温度极限与高可靠性要求下提供稳定连接(具体合规性与认证需确认厂方资料)。
  • 仪器仪表与测试设备:模块化交换、扩展板互连等。

六、选型与安装注意事项

  • 核对机械尺寸与布局:110P、5 排布局需与 PCB 针位、安装间距严格匹配,避免干涉。
  • 电流分配与散热评估:虽然单针额定 1.5A,但在高密度应用中需考虑总功耗与在板散热。
  • 插拔次数与可靠性:高频插拔场合应确认接触寿命与镀层耐磨性,必要时咨询 TE 提供的插拔寿命数据。
  • 清洁与防腐:镀金触头能抵抗氧化,但长期户外或腐蚀性环境下仍需采取密封、防护或定期维护。
  • 对位与锁紧:安装时确保正确的对位与锁紧动作以防错位或接触异常。

七、配套与替代建议

  • 同系列配套件:建议选择 TE Z‑PACK/A RAF 系列的配套母/公连接件、锁紧机构与线缆组件,以保证互换性与长期可靠性。
  • 替代方案:在更高电流或更高密度需求下,可考虑 TE 其他系列或同行厂商的等效矩形连接器;替换前应比对触头材料、额定电流、温度等级与机械尺寸。
  • 认证与合规:如需 RoHS、REACH 或军规级认证,请以 TE 官方数据表与合格证书为准。

八、结语

5100147-1(TE Z‑PACK/A RAF)是一款面向高密度互连、强调接触可靠性与宽温适应性的连接器方案。其 110P、5 排布局与镀金触头设计,适用于通信、工业及部分军工级应用。选型与设计时建议结合 TE 官方规格书、实际装配要求及热、电、机械综合评估,必要时联系 TE 或授权经销商获取完整技术支持与样品验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.