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TE Connectivity 1761987-9
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TE Connectivity 1761987-9
- Type
- TE CONNECTIVITY
- Unit
- Electronic Component
- Minimum package
- 400 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 1761987-9
- Electronic Component
- 1
- Package
- Through-hole
- Electronic Component
- Electronic Component
- Electronic Component
- Solder
- Electronic Component
- Connector
- Electronic Component
- EVERCLEAR
- Electronic Component
- 1.85g
- Electronic Component
- TE Connectivity AMP Connectors
- Electronic Component
- 1
- Electronic Component
- 38
- Electronic Component
- BM0230515607
- Type
- Surface Mount
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1761987-9 产品概述
一、产品简介
1761987-9 为 TE Connectivity（美国泰科）EVERCLEAR 系列的 Mini-SAS 插座型连接器，型号描述为 CONN MINI SAS RCP 38P SLD RA。该件为有源零件，适用于高速存储与交换系统的板对板/线对板连接，提供稳健的信号完整性与可靠的机械支撑。
二、主要特性
- 38 针（触点）迷你型 SAS 接口，面向小型化高速互连需求。
- 触头镀金，镀金厚度为 30.0 µin（0.76 µm），有利于降低接触电阻、抗氧化及延长使用寿命。
- 带板导轨（board rail）结构，增强插拔时的机械强度与定位精度。
- 直角表面贴装（SMT, RA）安装方式，便于封装在背板边缘或紧凑型 PCB 布局。
三、机械与端接
该连接器为插座（receptacle）样式，端接方式为焊接（solder termination），适配自动化贴装与回流工艺。板端配有导轨支撑，减少应力集中并提升长期可靠性。封装与包装支持卷带（TR），利于高速贴片生产线使用。
四、典型应用场景
适用于服务器与存储阵列、RAID 控制器背板、网络交换设备、SAN（存储区域网）端口以及其他需要高密度高速串行连接的工业与通信设备。尤其适合空间受限但需多通道可靠连接的场合。
五、装配与焊接建议
建议按制造商推荐的 PCB 布局与焊盘尺寸设计过孔和回流温度曲线；在回流焊后检查导轨与焊点完整性以确保机械支撑。采用 ESD 规范操作并在贴装与存储过程中保持干燥防潮。
六、包装与采购信息
- 制造商：TE Connectivity AMP Connectors（美国泰科）
- 系列：EVERCLEAR
- 包装：卷带（TR）
- 零件状态：有源（Active）
采购时请核对完整料号与包装数量，便于生产计划与库存管理。
七、维护与注意事项
为保证长期可靠性，应避免超出额定机械扭矩与插拔力，防止异物进入触点并定期检查镀金接触面。如用于关键系统，建议在设计阶段预留检修空间与替换方案。
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